Most of our customers use financing rather than capital outlays to grow their manufacturing business, and they have a number of smart reasons for doing so:

1. CHEAPER THAN CONTRACTING YOUR ASSEMBLY OUT

Companies can spend $10k and more a month contracting out their manufacturing, but you can typically bring an SMT assembly line in-house for a third of that when you lease or finance your line, and many companies already have a person on payroll who can operate the equipment.

2. EASIER TO GET THE GO-AHEAD

Financing typically requires fewer internal approvals than a capital purchase, making it the faster and easier route to an assembly line install or upgrade.

3. INCREASE YOUR PRODUCTION CAPABILITY SOONER THAN LATER

Rather than waiting until the money is there for a major capital outlay, with financing you can start the ball rolling on ordering, receiving, and installing your new equipment right away, allowing your company to benefit from increased capacity and capability much sooner than you might have otherwise.

4. GET BETTER EQUIPMENT

Financing gives you more purchasing power than a cash purchase. This means you can focus more on your goals than your budget.

5. ROLL IN INSTALLATION AND TRAINING

With a cash purchase comes the temptation to reduce costs, sometimes causing essential aspects like installation and training to be cut, but installation and training can have a big impact on how quickly your new equipment or production line gets up and running. Financing allows you to roll this cost into your payments.

6. PRESERVE YOUR WORKING CAPITAL

Making a large cash investment in your production line leaves you with less ability to put that money to other strategic uses, such as growing sales and increasing inventory.

7. IMPROVE CASH FLOW AND EXPENSE PLANNING

With financing, your new equipment becomes a regular monthly expense item in the budget.

8. OBSOLESCENCE PROTECTION

At the end of your lease term, equipment can be purchased at fair market value, upgraded, or swapped.

Simplifies receiving, storage and retrieval
Delivers full traceability
Automatically monitors stock levels

The SMT intelligent electronic material rack is a high floor area ratio shelf used to store the SMT patch devices.When loading, the materials are placed in the corresponding card position according to the plate, bind the LED indicator on the shelf through the corresponding relationship of the QR code of the material number / card position, and the ERP / MES system of the docking enterprise will automatically realize the operation of sending and receiving materials according to the light indication.
Delivery time is saved from two hours to 15 minutes, efficiency increase 8 times
Each shelf can store 1,400 plates of materials disorderly, and save the inventory area by 40%
The location of each item is quickly checked, and the inventory time can be reduced from 2 days to 2 hours
Material / warehouse / work order / station automatic binding, feeding and feeding process can prevent rigidity and error

THT Auto Insertion machine
1，Auto Insertion Axial Radial Oddform Production line.html
https://smthelp.org/html/Auto%20Insertion%20Axial%20Radial%20Oddform%20Production%20line.html

2，SLD250+S3010A+S7040T(tray feeder)+SULD250
AI machine production line.html
https://smthelp.org/html/SLD250+S3010A+S7040T(tray%20feeder)+SULD250%20AI%20machine%20production%20line.html

3，SLD250 S4020A+S3010A SULD250 AI machine
production line.html
https://smthelp.org/html/SLD250%20S4020A+S3010A%20SULD250%20AI%20machine%20production%20line.html

4，S7000 Oddform insertion 3 bowl feeder.html
https://smthelp.org/html/S7000%20Oddform%20insertion%203%20bowl%20feeder.html

5，S-7040T Oddform insertion w Tray
feeder.html
https://smthelp.org/html/S-7040T%20Oddform%20insertion%20w%20Tray%20feeder.html

6，S-7040 Oddform insertion w 4 bowl
feeder.html
https://smthelp.org/html/S-7040%20Oddform%20insertion%20w%204%20bowl%20feeder.html

7，Odd form insertion Feeders w
loader-unloader.html
https://smthelp.org/html/Odd%20form%20insertion%20Feeders%20w%20loader-unloader.html

Feeder

1,Bowl Radial reel feeder w JUKI cart.html
https://smthelp.org/html/Bowl%20Radial%20reel%20feeder%20w%20JUKI%20cart.html

2，JUKI Radial tape L lead feeder .html
https://smthelp.org/html/JUKI%20Radial%20tape%20L%20lead%20feeder%20.html

3，SMT tube feeder.html

https://smthelp.org/html/SMT%20tube%20feeder.html

4，SMT tray feeder -B.html
https://smthelp.org/html/SMT%20tray%20feeder%20-B.html

5，SMT label feeder.html
https://smthelp.org/html/SMT%20Tray%20feeder.html

6，SMT Tray feeder.html
https://smthelp.org/html/SMT%20Tray%20feeder.html

Nozzle

1，SMT nozzle list 1.html
https://smthelp.org/html/SMT%20nozzle%20list%201.html

2，Juki Nozzle 500 Assembly.html
https://smthelp.org/html/Juki%20Nozzle%20500%20Assembly.html

AI Spare Parts
1， Panasonic AI Spare parts
https://smthelp.org/html/Panasonic%20AI%20Spare%20parts%20list%202.html

2，UIC Radial Carrier Clip.html
https://smthelp.org/html/UIC%20Radial%20Carrier%20Clip.html

3，UIC Radial Feeder and Carrier Clip (1).html
https://smthelp.org/html/UIC%20Radial%20Feeder%20and%20Carrier%20Clip%20(1).html

4，UIC spare parts list 3.html
https://smthelp.org/html/UIC%20spare%20parts%20list%203.html

Please click below link to see 3D model:

https://smthelp.org/html/SMT%20nozzle%20list%201.html

[embeddoc url="https://smthelp.org/wp-content/uploads/2021/04/Southern-Machinery-logo-SMThelp.html" download="all"]

S-1688 Pneumatic Stencil Cleaning Machine

Comparison list

[embeddoc url="https://smthelp.org/wp-content/uploads/2020/11/A-difference-between-SME-800-Electric-Stencil-Cleaner-and-SME-750-Pneumatic-Stencil-Cleaner-1.doc" download="all" viewer="microsoft"]

The unit loads your production line automatically by pushing PCB’s out of a magazine onto the conveyor of the down-stream machine

[embeddoc url="https://smthelp.org/wp-content/uploads/2020/07/SMThelp-PCB-Conveyor-3D.pptx" download="all" viewer="microsoft"]

3D RS-1 Vibration Feeder

3D SMT PCB conveyor

3D SMT PCB Magazine

3D Southern Machinery logo

3D UIC Radial taped feeder housing

3D JUKI Gripper nozzle

[embeddoc url="https://smthelp.org/wp-content/uploads/2020/05/SMT-stencil-laser-making-machine.pdf" download="all"]SMT stencil production process (reference)

General technical requirements:
1. Screen frame: The frame size is determined according to the requirements of the printing machine. Taking DEK265 and MPM UP 3000 as an example, the frame size is 29ˊ
29ˊ, using aluminum alloy, frame profile specification is 1.5ˊ 1.5ˊ.

1. Stretching the net: Adopt the red glue + aluminum tape method, at the junction of the aluminum frame and the glue, a layer of protective paint must be evenly scraped. At the same time, in order to ensure that the screen has sufficient tension and good flatness, it is recommended that the stainless steel plate be kept 25mm-50mm away from the inside of the screen frame.

2. Reference point: According to the size and shape provided by the PCB information, the opening is 1: 1, and the translucent is engraved on the reverse side of the printing. At the corresponding coordinates, the entire PCB opens at least two reference points.

3. Opening requirements: 1.41. The position and size ensure a high opening accuracy, and the opening is strictly in accordance with the prescribed opening method. 1.42. The size of the independent opening cannot be too large, the width cannot be greater than 2mm, and a 0.4mm bridge is required in the middle of the pad size greater than 2mm, so as not to affect the strength of the stencil.
   1.43. The opening area must be centered.

4. Characters: In order to facilitate production, it is recommended to engrave the following characters in the lower left or lower right corner of the screen: Model; T; Date; the name of the company that made the screen.

5. Stencil thickness: In order to ensure the amount of solder paste printing and welding quality, the surface of the stencil is smooth and even, and the thickness is uniform. The stencil thickness refers to the above table. The stencil thickness should meet the premise of the finest pitch QFP BGA. If there are 0.5mmQFP and CHIP 0402 components on the PCB, the stencil thickness is 0.12mm; if there are 0.5mmQFP and CHIP 0603 or more components on the PCB, the stencil thickness is 0.15mm;

The opening shape and size requirements of printed tin screen:

1. General principle: According to the requirements of the IPC-7525 steel mesh design guide, in order to ensure that the solder paste can be smoothly released from the opening of the stencil to the PCB pad, in the opening of the stencil  to view polyester 1. The area ratio / width-to-thickness ratio area ratio is greater than 0.66 2. The mesh hole wall is smooth. Especially for QFP and CSP with a pitch of less than 0.5mm, suppliers are required to perform electro-polishing during the manufacturing process. 3.) With the printing surface as the upper side, the lower opening of the mesh opening should be 0.01mm or 0.02mm wider than the upper opening, that is, the opening is inverted tapered, which facilitates the ineffective release of solder paste and reduces the number of times of cleaning the stencil. Normally, the size and shape of the opening of the SMT element is the same as the pad, and the opening is 1: 1. Under special circumstances, for some special SMT components, the size and shape of the screen openings are specified.
   No. 2 Special SMT component screen opening:

2.1CHIP components: CHIP components above 0603, in order to effectively prevent the generation of tin beads.

2.2SOT89 components: Due to the large pad and small pad spacing between components, soldering quality problems such as tin beads are prone to occur.

2.3 SOT252 component: Because SOT252 has a large pad, it is easy to produce tin beads, and the reflow soldering tension causes displacement.
Look 2.4IC: A. For the standard pad design, PITCH》 = 0.65mm IC, the opening width is 90% of the pad width, and the length is unchanged.
B. For the standard pad design, IC with PITCH <= 005mm, because of its small PITCH, it is easy to produce bridging, the length direction of the steel mesh opening is unchanged, the opening width is 0.5PITCH, and the opening width is 0.25mm.
2.5 Other situations: One pad is too large, usually one side is greater than 4mm, and the other side is not less than 2.5mm, in order to prevent the generation of tin beads and displacement caused by the effect of tension, the mesh opening is recommended to be divided by grid lines In this way, the grid line width is 0.5mm and the grid size is 2mm, which can be evenly divided according to the pad size.

The shape and size requirements of the opening of the printed rubber screen: glue is used for simple PCB assembly. Dispensing is preferred. CHIP, MELF, SOT components are printed through the screen, and IC is used to avoid glue scraping. Here, only the recommended opening size and opening shape of CHIP, MELF and SOT offset printing plates are given.
1. Two diagonal positioning holes must be opened at the diagonal of the stencil. Select FIDUCIAL MARK to open the hole.

1. The openings are all elongated. Inspection method 1) Visually check that the opening is centered and the net is flat. 2) Check the correctness of the stencil opening through the PCB entity. 3) Examine the length and width of the screen opening and the smoothness of the hole wall and the surface of the steel sheet with a scaled high power microscope. 4) The thickness of the steel sheet is verified by detecting the thickness of the solder paste after printing tin, that is, the result verification. Conclusion The technical requirements for screen design have been tested for a period of time, and the print quality has been well controlled. The PPM of SMT welding quality has dropped from about 1300ppm to about 130ppm. Due to the development of the packaging direction of modern electronic components, higher requirements have also been placed on the design of steel mesh. Is a subject that we need to focus on in the future

SMT (Surface Mount Technology), or surface mount technology, is one of the most popular technologies and processes in the electronics assembly industry. In the Pearl River Delta represented by Shenzhen, the electronics and information industry is developed and the industry chain is complete. It is a veritable factory in the world.

As the market environment changes and technology changes, in order to meet the increasingly personalized needs of end customers, manufacturers are constantly improving their products, constantly innovating according to market needs, and developing trendy styles and functions to adapt to the current market demand. In order to be able to quickly respond to market diversified and uncertain needs and quickly provide products that meet customer needs, “short, flat, and fast” has become an important feature of production sites during this period, on time, quality, quantity and at a minimum cost Manufacturing products that meet customer needs has become the goal of production management, but progress is seemingly more and more difficult due to resource constraints such as limited skilled personnel and tight equipment. In this case, SMT production is now in a state of small batches and multiple varieties. Because of the inherent production characteristics of the SMT production line, it uses the best production efficiency in large batches. Therefore, for small batches and multiple varieties, there are multiple line changes to complete the production conversion of the product. The SMT line is in an intermittent production state. The increase has caused problems in the production efficiency of the SMT line.

One
Benefits of small batches and multiple varieties

1.Improve adaptability to changes in demand
Small batch, single piece delivery
Reduce job preparation time
Multi-skilled employees
In-process quality assurance system
Generalization of equipment and tooling

1. Make manufacturing issues and their weaknesses visible
   Quality failure
   Equipment failure
   Workload imbalance
   Turnover time

2. Eliminate waste caused by improper production management and reduce production management costs
   Material waiting due to improper production management
   Unnecessary model changes due to improper production management
   Increase in indirect operations due to improper production management

4.Improve the adaptability of manufacturing to short delivery time
Eliminate stagnation (things / information)
Reduce the number of intermediate work in process
Synchronization

two
Characteristics of small batches and multiple varieties

Multi-variety parallel

Because many enterprises’ products are configured for customers, different products have different needs, and the resources of enterprises are among multiple varieties.

Resource sharing
Every task in the production process requires resources, but the resources that can be used in the actual process are very limited. For example, the problem of equipment conflicts often encountered in the production process is caused by the sharing of project resources. Therefore, limited resources must be properly allocated to meet project needs.

1. Uncertainty of order result and production cycle
   Due to the instability of customer needs, the clearly defined nodes are inconsistent with the complete cycle of human, machine, material, method, ring, etc., the production cycle is often uncertain, and projects with insufficient cycles require more resources. , Increasing the difficulty of production control.

three
Difficulties in small batch and multi-variety production

1. Dynamic process path planning and deployment of virtual unit lines: emergency insertion, equipment failure, and bottleneck drift.
2. Identification and drift of bottlenecks: before and during production
3. Multi-level bottlenecks: bottlenecks on assembly lines, bottlenecks on virtual lines of parts, how to coordinate and couple.
4. Buffer size: either backlog or poor interference resistance. Production batch, transfer batch, etc.
5. Production scheduling: not only consider bottlenecks, but also the impact of non-bottleneck resources.

Many varieties and small batch production models will also encounter many problems in enterprise practice, such as:
Multi-variety and low-batch production, mixed scheduling is difficult
Unable to deliver on time, too much “fire fighting” overtime
Order requires too much follow-up
Frequent changes in production priorities, the original plan could not be implemented
Increasing inventory but often lacking critical materials
The production cycle is too long, the lead time is infinitely expanded

▎How to implement automatic upgrade has become a trouble for OEM companies

The electronic information industry is still a pillar industry in Shenzhen, with an industrial scale of more than 1.200 billion yuan, accounting for about 1/7 of the national electronic information manufacturing revenue. In Shenzhen, there are a large number of leading electronic information companies such as Huawei, ZTE, and TCL, as well as a large number of small-scale lean manufacturing and processing enterprises that were born in response to the needs of the times.

Due to the production characteristics of traditional foundry companies, “different bills of materials for each order, different production processes, different cleaning standards, different packaging requirements, and different labeling specifications”, unlike large factories that do standard products, they can be automated on a large scale upgrade.

How to use industrial robots, advanced automation management platforms, and information technology to help these enterprises achieve flexible production and agile manufacturing are the topics they care about in common.

Under the pressure, many traditional OEM companies have begun to transform to ODM (Original Design Manufacturer), and gradually pay attention to independent intellectual property rights, start to make innovative products, and start to develop independent brands.

▎ Machine substitution may be a “beautiful trap”, how to realize flexible production is the key

China’s Industry 4.0, like an aircraft carrier, propels China forward. For these small and small batch OEM companies, after experiencing the “prosperity era” brought by the demographic dividend, they are also thinking about how to take the road of independent innovation.

Perhaps many OEM companies rely on the channel advantages accumulated over many years of operation and the natural industrial chain advantages of the Pearl River Delta. But the demographic dividend is no longer, the cost advantage is no longer, and the rise and penetration of the Internet has also led to major changes in production methods, management concepts, production equipment, and even raw materials. These factors have begun to cause some entrepreneurs to worry about the future.

“Without the independent innovation of Chinese companies, we can only be a world factory. Without trial and error and iteration of research and development, we will never have our own core technology.”

How to innovate? Is machine substitution really the general trend?

For these manufacturers, there may be pitfalls in purely pursuing “machine substitution” oriented by automated equipment, mass production, and reduced manufacturing costs. Because for them, the key to “machine substitution” is how to implement software flexibility, agile programming, or automatic programming, just like “quick mode change” in TPS (transaction processing system).