Southern Machinery

Screen Frames
	External (w x l x t)	Internal (w x l)	Type
Standard	736 x 736 x 38/40mm

(29” x 29”)660 x 660mm

(26” x 26”)DEK 265

Options*

585 x 585mm

 

(23” x 23”)508 x 508mm

(20” x 20”)DEK 260 All common stencil sizes available:

Sanyo, Ekra, Fuji, Panasonic MPM etc.

Image to Stencil position

Centre, Front, Custom  Board Handling

Minimum size

50 x 70 mm

Maximum size

510 x 508 mm *(610 x 508mm)

Thickness

0.2 – 6 mm

Warpage

Up to 8mm including PCB thickness

Underside component

clearance

 

 

Programmable 3- 42mm

Transport conveyors

Programmable motorized

Transport Direction

Left to Right

 

Right to Left

Left to Left

Right to Right

Interface Protocols

All popular interfaces available

Board Location

Patented Over the Top clamps

 

Edge clamping*

Vacuum*

Registration

Fully automatic Vision.  Process Parameters

Print Speed

2 – 150 mm/sec

Print pressure

0 – 20 kg  Software programmable (*closed loop feed back)

Print Gap

0 – 6 mm

Stencil separation

Speed:      0.1 – 20 mm/sec

 

Distance:  0 – 3 mm

Print Modes

ProFlow^TM*

 

Print Print

Print Flood

Flood Print

Adhesive

Paste Knead

Programmable: Number, Period, On demand  Vision

Vision System

Cognex 8100 vision system

Camera lighting

Software controlled programmable lighting

Fiducials

2 or 3

Fiducial Types

Synthetic fiducial library or unique pattern recognition

Fiducial size

0.5 – 3 mm

Fiducial position

Anywhere on PCB

Fiducial error recovery

Auto lighting adjustment.

 

Auto fiducial search.

Smart fiducial.

Comparison: Radial II vs. Radial 5 versus Radial 8 and Radial 8xt

Updated 11-2004

 

Feature	6346A/6348A Radial II	6360D Radial 5	6380A Radial 8	6380B Radial 8xt	Benefit
Machine Speed	7,200/Hour	9,200/Hour	16,0000/Hour	21,0000/Hour	Higher throughput.
Main Drive System	Pneumatic	Pneumatic	DC Brushless Servo	DC Brushless Servo	Significant reliability increase.  Lower noise level and higher machine uptime.
Component transfer/CTA	Loader	CTA pneumatic	CTA pneumatic	CTA servo drive	Less maintenance, fewer adjustments, higher speed and reliability
“Off axis” insertion	No	No	No	Yes	Radial 8xt can insert at one degree increments.
Machine Controller	DEC J11	DEC J11	VME 68000	VME 68000	Higher speed, capable of supporting more features than the DEC J11.  Modern architecture, support available.
User interface	UICS	UICS	IM-UPS (Like GSM) USOS	IM-UPS (Like GSM) USOS	Powerful graphical interface with CRT, keyboard, trackball, consistent with GSM products.
Soft Touch Pusher (STP)	No	Yes, pneumatic.	Yes, servo controlled.	Yes, servo controlled.	Stabilizes components during insertion for higher reliability  Servo control means less maintenance, higher performance.
Management Data	Non-user friendly binary format	Non-user friendly binary format	Easily accessible management data	Easily accessible management data.	Displays management data in graph form at the click of a button.  Further improvements on latest Radial 8xt.
Diagnostics	Non-user friendly binary format	Non-user friendly binary format	Menu Driven	Menu Driven	Powerful IM diagnostics allow for easy troubleshooting.
Triple Span Radial available	No	Yes, non standard.	Yes	Yes	Optional tooling available to insert 2.5/5.0/7.5 mm span components
On Line Documentation	No	No	Yes	Yes	Supports quick on-line retrieval of machine operating and maintenance information.
Chain Clip Locating	No	Yes	Yes	Yes	Reliability, fewer adjustments.
100 Station Sequencer available	No	Yes	Yes	Yes	More components/input.
Auto Recovery	No	No	Yes	Yes	Higher PCB quality.
Clinch Scrap Lead Enhancement	No	No	Yes	Yes	Increased uptime.
Odd Form Capability	No	No	Yes	Yes	Smooth servo drive leads to increased component insertion capabilities.
In-Line or Straight back  Sequencer Available	No	Yes	Yes	Yes	Manufacturing floor space.
Single Pivot Clinch	No	Yes	Yes	Yes	Increased uptime/longer tooling life, fewer adjustments.
13mm Body Diameter Component Capability	No	No	Yes	Yes	Increased component insertion capabilities.
Low Part Warning visible to operator.	No	No	Yes	Yes	Audible as well as visual notification to operator on CRT.
Uninterruptable Power Supply	No	No	Standard	Standard	Allow for proper machine shut down and uninterrupted operation during power fluctuation.
Product Trainer	No	No	Yes	Yes	Available CD Rom Software provides on-line training for machine operation.
CE Mark European Code compliance.	No	Yes	Yes, only with auto board handling.	Yes, with OR without auto board handling.	Compliant with European Community safety standards.
4 Tier Light	No	Yes, not configurable.	Yes, user configurable.	Yes, user configurable.	Improved machine status information for more efficient machine operation.
CD-ROM for software loading	No	No	Standard	Standard	Allows for fast loading of software updates and on-line documentation.

 

Global Semiconductor Report

New Trends Impacting Electronics Assembly

 

Not only are the ubiquitous “smaller, cheaper, faster” drivers forever reshaping electronics, but the demand for multi-functionality and mobility is also fueling the convergence of the computer, telecommunications, and consumer markets.  Computer games can now be linked to the Internet. Cellular phones can be used to purchase soft drinks and send e-mail.  Bluetooth technology is making wireless data transfer possible for computer and consumer products.  With all of these changes in the products themselves, we can expect to see modifications in their manufacturing requirements.

 

The increasing sophistication of electronics products is driving advances in a number of aspects of electronics assembly, from components and substrates to the materials and processes used in production. We can start to see new trends at the component level.  The explosion of the wireless market and increasing demands for advanced functionality in cellular phones have led to a steady rise in the number of components per phone within the same small space.  Due to the throughput and yield constraints these requirements place on cellular phone manufacturers, we are experiencing a resurgence of multi-chip modules.

 

Because multi-chip modules can be pre-assembled and tested, performance issues affecting yield are typically resolved prior to production of the final product. Additionally, if a performance issue does arise with a multi-chip module, the module can be removed from the circuit and replaced without sacrificing the other components on the circuit board.

 

In turn, the growing volumes of multi-chip modules are driving the need for much smaller (less than 1 mm) and thinner (less than 0.1 mm) dies as well as smaller capacitors (0201).  At the other end of the spectrum, microprocessors and high-end Asics are pushing die sizes above 400 square millimeters and pin counts above 2000 I/O’s. Wafer sizes are scheduled to migrate to 300mm, which will significantly impact all semiconductor-related equipment.

 

On the substrate side of the package, new challenges arise as the demand for advanced packaging and high density rigid and flex substrates increases. Challenges associated with manipulating and imaging these novel carriers and ensuring accurate placement of fine pitch components, which can be compromised by solder mask registrations, are driving changes in equipment handling, illumination (see figure 1) and vision systems.

 

Regarding process, flip chip and wafer level packaging present requirements for new fluxes, new underfills, and flux and underfill combinations with some level of particle fillers and new conductive adhesives. This translates into dispensing, vision and placement challenges for the assembly equipment.  Additionally, the regulatory push in Asia and Europe to eliminate lead will force the use of more lead free solders, whose higher reflow temperatures place more pressure on substrate materials and component reliability.  The drive to eliminate lead will also increase the use of conductive adhesives that require higher pressure and temperature during placement, greatly impacting machine throughput.

 

In light of these challenges, what is the ultimate package?  Unfortunately, there is no ultimate package or silver bullet.  Everyone has a favorite BGA, CSP, and WLCSP “du jour” from different suppliers.  Today’s applications require different permutations of materials and processes, leading to a multiplicity of packages and form factors. The traditional boundaries between component (first level packaging) and card assembly (second-level packaging) have all but disappeared.

 

To handle a myriad of different substrates and new process materials, placement equipment is facing new requirements for increased flexibility and more sophisticated vision systems and lighting schemes. To keep up with the volatility of the market, electronics manufacturers are looking to partner with suppliers that provide both placement equipment and process solutions for state-of-art assemblies, global supply capabilities and best-of-breed cost of ownership.

 

Biography:

Richard Boulanger is Vice President of the Advanced Semiconductor Assembly Division of Universal Instruments Corporation.  This business unit focuses on bare die and flip chip applications such as plastic and ceramic ball grid arrays, flip chip on flexible circuits and hybrid assemblies.

 

 

 

 

[CAPTION, for figure 1, attached “BlueLight.jpg”]: New approaches to illumination are improving vision clarity and increasing placement accuracy on advanced substrates such as flexible circuits.

IM Applications Analysis Request Matrix For Sales Engineers

 

 

Request	When should you use this?	What we need	What you will receive from us
Throughput analysis	Get customer interested in Generation 8 machines by showing them throughput advantage of new equipment.	Pattern program (UIC, competitor, or text component location file)orQuantity of components per panel	Analysis showing how many boards of the sample product type will be produced per hour/day/month using Gen 8 equipment.
PCB evaluation	Determine how many components currently being hand inserted or inserted by old UIC or competitor equipment can be inserted with Gen 8 equipment.	Fully populated PCBBare PCBPattern program (UIC, competitor, or text component location file)	Report listing which components can be inserted “as is”, which can be inserted with minor modifications to the board and which cannot be inserted.
Machine demonstration	Customer is not familiar with Universal or is not familiar with Gen 8 equipment.  Introduce customer to Universal’s support infrastructure, help establish UIC as a partner rather than merely a vendor.	Demo with UIC boards – call to discuss timing of visit and machine availabilityDemo with customer boards – Same as above as well as customer boards (one fully assembled, several bare) and any “unusual” components along with pattern program (if available) at least 2 weeks prior to visit.	Upon request, we can give a Gen 8 equipment presentation tailored to the customer, a plant tour and/or demonstrate the Gen 8 machine(s) using the customer’s product.
Machine replacement proposal	Show customer we can replace old (UIC or competitor) http://ambienbuy.net machines with fewer Gen 8 machines.	“Average” number of components per panel or actual number on a representative panel.Hours per day and days per week machine(s) are in production.Qty of panels required per day.	Report showing the number of machines required to meet the requested production quantity as well as the total capacity of the machine(s).
Machine financial justification	Show how Gen 8 equipment can pay for itself by saving operator and maintenance labor as well as reducing replacement parts cost.	Same information as for machine replacement study and:Current spare parts cost (preferably in $/M insertions).Operator and technician fully burdened labor rate.	Report showing number of machines required to meet production quantity as well as projected savings in labor and spare parts compared to old equipment.
Cost per insertion report(competitive comparison)	Show how UIC Gen 8 equipment compares with competitors equipment.	Same information as required for machine financial justification and:Any information you can provide about the competitor’s proposed solution.  Include competitor price quotes and machine mix if possible, otherwise we will use our estimates which may be different than your customer’s situation.	Report showing number of UIC and competitor machines required to meet production quantity.  “Cost per insertion” calculation for UIC and competitor equipment.  This type of calculation helps us show that the cost of operation can be lower with UIC even though our equipment price may be higher than the competition.