Radial 8 N-Clinch tooling for machines that have the following Product Trees:

 

Dual Span	Triple Span (2.5/5.0/7.5)	Triple Span (5.0/7.5/10.0)
47040006	90055555	90055556
47040007	NA	NA
47040008	90055838	90055848

 

To determine the machine’s Product Tree, refer to the silver tag on the right side of the machine, near the red power switch.

 

The new N-clinch tooling has been redesigned to increase its strength and wear resistance. This new tooling is easily identified by its black color as opposed to the gold color of the current tooling.

 

According to our records you have purchased at least one Radial 8 which can benefit from this new tooling.  We are informing you of this so that you may consider changing over to this new tooling to take advantage of the enhancements if you have not already done so.  We are also informing you that we will cease to offer the current gold color tooling by October 2000.

 

The new black tooling pieces are not interchangeable with the previous gold tooling.  The clinch tooling must be changed as a full set, using one of the retrofit kits in the table below.  Replacement parts ordered after the retrofit kit is installed may be ordered individually. The parts we have changed only affect the normal wear tooling pieces that you normally change during preventive maintenance cycles.  We recommend that you allow your current gold color tooling to reach the end of its life and then replace it with the enhanced kit.

 

Please refer to the table below to order the proper part numbers.

 

Clinch tooling retrofit kits

 

Radial 8 Dual Span

CLINCH STYLE	RETROFIT KIT P/N	DESCRIPTION	NEW P/N	QTY
90L Offset Higher Pivot (46666601)	48678201	Anvil, Exterior	43902303	2
		Anvil, Interior	43902103	1
		Cut/Form, Exterior	43902204	2
		Cut/Form, Interior	43902006	1
90S Offset Higher Pivot (47803401)	48678202	Anvil, Exterior	47803302	2
		Anvil, Interior	47803102	1
		Cut/Form, Exterior	47803202	2
		Cut/Form, Interior	47803002	1

 

Radial 8 Triple Span

CLINCH STYLE	RETROFIT KIT P/N	DESCRIPTION	NEW P/N	QTY
2.5/5/7.5 90 SLL RSP (90055732)	48678203	Anvil, Exterior	47803302	2
		Anvil, Interior	47803102	1
		Cut/Form, Exterior	47803202	2
		Cut/Form, Interior	47803002	1
		Anvil, Exterior 7.5	90055841	1
		Cut/Form Exterior 7.5	90055840	1
5/7.5/10 90 SLL RSP (90055752)	48678204	Anvil, Exterior	47803302	2
		Anvil, Interior	47803102	1
		Cut/Form, Exterior	47803202	2
		Cut/Form, Interior	47803002	1
		Anvil, Exterior 7.5	90055841	2
		Cut/Form Exterior 7.5	90055840	2

 

2.5/5/7.5 90 LLL RSP (90055729 or 90055743)	48678207	Anvil, Exterior	90055863	2
		Anvil, Interior	90055864	1
		Cut/Form, Exterior	90055865	2
		Cut/Form, Interior	90055866	1
		Anvil, Exterior 7.5	90055839	1
		Cut/Form Exterior 7.5	90055819	1
5/7.5/10 90 LLL RSP (90055436 or 90055750)	48678208	Anvil, Exterior	90055863	2
		Anvil, Interior	90055864	1
		Cut/Form, Exterior	90055865	2
		Cut/Form, Interior	90055866	1
		Anvil, Exterior 7.5	90055839	2
		Cut/Form Exterior 7.5	90055819	2

 

 

 

New High Pivot N-Clinch

If you own a Radial 8 with a Product Tree number other than those listed above, or any of our Radial 5 machines, you may also take advantage of this new enhanced clinch tooling by ordering a new style high pivot N clinch.  The high pivot N clinch automatically comes with this new tooling.  The high pivot N clinches offer greater cutting force than the former low pivot clinches.  You will need the high pivot N clinch in order to take advantage of this new tooling.

 

If you chose not to purchase a high pivot N clinch, the tooling that accommodates the low pivot clinches will still be available.

 

Since all Universal Instruments Corp. radial machines use the same clinch mounting system, you may simply order the new style high pivot N clinch to replace your low pivot type.  It’s a “drop-in” replacement.

 

New High Pivot Clinch
Clinch	Lead spans	Part number
90 Short lead length	2.5/5.0 mm	47803402
90 Long lead length	2.5/5.0 mm	46666602
90 Short lead length	2.5/5.0/7.5 mm	90055850
90 Long lead length	2.5/5.0/7.5 mm	90055868
90 Short lead length	5.0/7.5/10.0 mm	90055852
90 Long lead length	5.0/7.5/10.0 mm	90055862

 

 

Fiducials and Pad Sites

A fiducial is a board feature used for global and local error correction to determine the difference between programmed coordinates and actual locations on the board. This ensures that parts are not placed before their locations are verified.

 

A pad site is a pad pattern on the production board that can be used in the same manner as a fiducial.

 

The most typical types of fiducial failures are caused by improper color, size of fiducial, and lighting values. Other factors such as the confidence level and search area can also be trouble spots but as the programmer’s experience level increases, these will be less likely to cause problems.

 

How many fiducials to use on a board or circuit will depend on board quality and the amount of time the manufacturing process can allocate to finding fiducials. The following is a general guide as to the number of fiducials used and the benefits of accuracy.

 

Number of Fiducials Found

Correction Possibilities

 

1

 

X and Y

 

2

X, Y, and Theta

 

3

 

X, Y, Theta, and Uniform Stretch

 

4-5

X, Y, Theta, and Independent X & Y Stretches

6-10 (max)

 

X, Y, Theta, Independent X & Y Stretches, and Corners not equal to

90°

 

The total number of fiducials and pad sites that can be used for a global correction cannot exceed ten.

 

To use a combination of fiducials and pad sites for global error correction, you must assign them in the Circuit List window.

 

The total number of fiducials and pad sites that can be used for a local correction cannot exceed five.

 

To use a combination of fiducials and pad sites for local error correction, you must assign them in the Local Fiducials dialog box in the Placement List window.

 

When creating a fiducial or pad site, use the Tab key to move between the data fields. If you use the Enter key, the fiducial placement is attempted and error checking is performed.

 

To successfully create valid fiducial placements:

–      Fiducials must be placed within the borders of the board.

–      Fiducials cannot be placed directly on offsets. (Fiducials placed on circuits

are automatically duplicated on all the offsets associated with that circuit.)

–      Fiducials cannot be partially on a board or circuit.

 

If a fiducial is on an offset and that offset is rotated, the fiducial location is rotated but the fiducial is not. Only fiducials with rotational symmetry are supported in this manner. All others will not be found.

 

If multiple fiducial or pad site definitions are selected when using the Fiducial or Pad Site Copy function, all new fiducials and pad sites are distanced from the originals by the same X and Y Offset values.

 

If fiducials or pad sites are consistently not found by the vision system, lower the confidence level. If the vision system finds objects other than the fiducials or pad sites, increase the confidence level.

 

When defining a search area, keep in mind that it should be large enough to allow some tolerance in board handling, but not so large that additional board features are found instead of the fiducial or pad.

 

Some recommended lighting levels for fiducials and pad sites.

 

Fiducial Type / Pad Site	Inner Ring	Outer Ring
Tinned / Tinned	80 / 80	20 / 20
Solder Mask over Bare Copper (not recommended) / Gold	0 / 0	50 / 35
Bare Copper with Copper Bright / Bare Copper	0 / 0	35 / 35

 

 

The pad site functionality is not available for the Odd Form system at this time.

 

In most cases, standard lighting cannot be used to image a pad site since solder paste or flux may not allow a good contrast between the pad site and the circuit board. Special lighting settings may need to be installed in order to image the pad site. If  Pad Site Find is the only way to get component corrections, and lighting is the only issue, consult your UIC Application Engineer.

 

Use the Fiducial Lighting procedure located in the Operation Features Module within the User’s Guide, to determine whether a pad site can be imaged with the PEC camera. Verify contrast and the lighting level required.

 

When to use Pad Site Find

1) When fiducials do not exist on the circuit board

2) When the pad site accurately represents a component type

3) When fiducials do not give an accurate enough correction

4) When accuracy is more important than speed

 

If any errors occur finding pad sites, you will be taken to the Fiducial Repair screen. In the case of failed pad site finds, manual alignment is not recommended. For GSM1 systems, select the Reject Board button to remove the board. For GSM2 systems, palm down the machine to manually remove the board.

 

The need for a pad site correction is more typical of fine pitch placements such as C4 placements or fine pitch BGA’s.

 

Pad sites are based on component definitions. To associate a pad site definition with a component, the component must be defined in the database. Refer to the New Component module for information on adding a component to the database.

 

 

PEC Lighting

 

On the GSM machine, a Pattern Error Correction (PEC) camera passes an image to the vision system which attempts to recognize a programmed fiducial or pad site based on parameters in the Fiducial or Pad Site List. These parameters consist of type and size, center of fiducial identified by its “X,Y coordinates”, and the search area identified by “Search Area X,Y”.

 

After the PEC camera moves to the programmed location of the fiducial, it illuminates the Search Area using the programmed “IN/OUT” (inner ring/outer ring) light levels. Within the search area of the image, light intensity differences between the fiducial and the board help the vision system detect the fiducial’s edges.

 

The vision system is able to detect the North, South, East, and West edges of the fiducials by relying on the differences in contrast between the board and the fiducial color. Called vector points, triangles of red, blue, green, and yellow are displayed in the Vision Window.

The vision system uses six vector points per edge (N, S, E,W). In order for the vision system to obtain 100% confidence, 24 out of 24 of the vector points must be detected on an edge of a fiducial. The default confidence level is 80% (19.2 rounded up to 20 vector points).

 

Since the success of fiducial finds depends on the vision system’s ability to discern the contrast between the board and the fiducial, some combinations of fiducials (or object(s) to find) and their backgrounds may call for different types of PEC cameras. Currently 2-sided and 4-sided lighting is being used and FlexLight, a new feature, will soon be available. The 2-sided PEC camera was non-symmetrical in its lighting pattern. It illuminated in one direction, from the North and South. The 4-sided PEC camera improved on this by illuminating in four directions, from the North, South, East, and West. Originally both cameras used red LED’s.  When looking at solder-mask covered fiducials, the red light would be absorbed by the solder mask (green). To overcome this problem, green LED’s were added. The 4-sided scheme expanded the capability to illuminate gold fiducials on white ceramic as well as fiducials on flexible circuits.

 

FlexLight (trademark) is an enhanced PEC lighting module.  It was originally developed to address the imaging challenges associated with advanced substrates such as ceramics and flexible circuits.  Although FlexLight was initially targeted at these markets, it can effectively image a wide variety of substrate materials ranging from FR-4 to more exotic materials.  The chief advantages of FlexLight are: 1) Symmetric illumination, 2) Polarization flexibilty,

3) Wavelength flexibility, 4) Ease of reconfiguration, and 5) Monolithic design.

 

A mechanical support structure holds eight LED petals and an inner LED ring. Each petal is a small printed circuit board containing 10 LED’s.  The petals can contain light sources of various wavelengths ranging from blue to red.  The petals and the inner ring can be exchanged in a “plug-and-play” fashion.  This allows the illumination wavelengths of the module to be quickly and easily changed.  It also facilitates ease of service in the field. The supporting electronics allow the petals to be configured in various series and parallel combinations to support a wide variety of LED’s.

 

The structure supports an optional polarizing film that covers four of the eight petals as shown in the following diagram.

Corner Feature Enhancement for Multipattern Components

 

Multipattern components consist of components or objects (RF shields, connectors etc.) which cannot be described adequately as either leaded or leadless components, but rather are defined in terms of an arrangement of geometric features.  The multipattern object is located by locating each of the features of which it is comprised, using a single or multiple fields of view.  One such feature, which is commonly used to locate rectangular or pseudo-rectangular objects, is the corner feature.  At present, this feature is defined simply by entering the length of each of the two line segments, which make up the 90 degree corner (the horizontal corner edge length and the vertical corner edge length).  With this special software, this feature definition has been extended to allow for two more optional parameters.  These parameters define “ignore zones” at the apex of the corner, and allow the image processing to ignore these regions of the edges when locating the corner.  By this means corners which are rounded, chamfered or poorly defined at the apex can still be located by using segments of the corner away from the apex, which subtend 90 degrees to each other.

 

The diagram below indicates the meaning of each of the parameters.

 

 

 

 

 

X2, Y2 should not exceed 25% of X1, Y1

If  X2 or Y2 = 0, the standard corner find is employed

 

 

 

 

 

Enhanced Product Setup

 

 

A very helpful feature when programming components is Enhanced Product Setup. It consists of two parts, Enhanced Component Setup and Enhanced Board Setup. Each process involves a live image, of the object being taught, to be manipulated while the programmer sees the changes as they are being made.

 

When defining a new component, fill in as many data fields as possible while paying special attention to the following; Component Height, PreOrient, Number of Leads, Lighting Type, Camera Type, Default Feeder, Default Orientation, and Reject Station.

 

Enhanced Component Setup supports, Four Spindle, C4, OFA (Oddform Assembly) and High Accuracy (UFP) Heads.

 

If anything goes wrong with the Platform machine during this entire process (reject station not mounted, feeder not mounted, exclusion zone, drop bin not defined, centering fails due to invalid parameter, etc…) recover by palming the machine down, and up again. Then push the Start button and proceed to pick the part again.

 

If the Platform machine was not calibrated correctly prior to using EPS, the scale of the drawing may be incorrect and the Draw Component function cannot be used.

 

All changes made are immediately written back to the database scroll list where the part was defined. Exit the Inspection screen at any time to view the results of the changes there. Nothing is saved permanently until the part is saved.

 

 

Common ECS Hinderances and Solutions

 

Before the part can be picked, all the values associated with component definition must be entered. This is necessary because these values are all needed to inspect a component.

 

All changes to the drawing are immediately applied to the definition database of the component. If a mistake is made, rectify the error by using the Undo function. No change is permanent until the component is saved.

 

To switch from editing the body of the drawing to any of the leads/bumps/features, click on the leads/bumps/features. To switch back to editing the body, click where there is no lead/bump/feature.

 

Due to the method used for programming leads, it can be difficult to line up all the leads over their displayed counterparts. This is because pitches are measured from the center of the side of the component, and when they are adjusted, leads move symmetrically out or in from/to the center. To help the adjustment, if there is an odd number of leads, position the single lead in the center of a side over its corresponding displayed counterpart. If there is an even number of leads, position the two center leads over their displayed counterparts before adjusting the pitch.

 

To define a C4 component it is sometimes convenient to define only one bump initially, and add bumps when the image is displayed, wherever necessary until the part is found. This is a good procedure because it may be difficult to determine how bumps will image before seeing an image of the part.

 

When dealing with a large number of leads/bumps at once (over 50), the drawing function will automatically move only the single lead selected, instead of all the leads. This is done to increase the performance of the drawing operations. If less than 50 leads/bumps are selected, they will all be repositioned at once to give a better indication of their final positions.

 

One of the more difficult things to deal with is when the displayed part’s rotation is slightly off. Make sure that the feeder pick position is optimal to present the part accurately. Use the pick/inspect/drop-off sequence more than once if necessary until the part is basically square on the screen.

 

Lead groups can cause additional problems. The drawing always assumes that all leads are present on a side, but does not draw some of them if they were deselected in the leadgroup screen. This can make it difficult for pitches to be adjusted.

 

If the component is too large to fit into a single field of view, the vision system will take more than one image and stop at the first image where it could find all leads/bumps/features. This might be the first image seen, or the last. If the part is found successfully, it will be the last. This makes editing of the components, by using the Draw Component function, difficult. Sometimes it is more convenient in this case to go back and forth between the Database Component Definition screen and the Inspection screen.

 

When viewing a component on the monitor, the image detail may require enhancement. With the use of Vision Level Diagnostics, the operator can increase or decrease the detail of the viewed image by raising or lowering the current vision level. By increasing the Vision Level Diagnostics to a level 5 setting, the operator can view the image with the maximum amount of detail. Using a lower vision level results in a decrease in display detail.

 

 

 

Specific Component Programming

 

If a change is necessary while adding a  new component to the database, do not change the component type, exit and begin the procedure again.

 

The Accuracy field applies only to a GSM2 (Dual Beam) machine. When the value is set at high, this means stop the opposite beam while I place this particular part with the other beam. Our accuracy studies indicate there is no need to ever run the machine with this value set to high. It adversely effects throughput and does not contribute to the accuracy of the machine when placing standard SM devices. Ignore this field for any other machine configuration.

 

For parts that do require a more accurate placement it may be advantageous to turn on preorient.  This indicates to the machine that the part will be rotated to it's place rotation prior to being scanned through the upward looking camera.This allows the machine to minimize the amount of correction required after being centered and inherently contributes to a more accurate and repeatable placement.  It does however adversely affect throughtput.  Therefore, if you find you the placement accuracy does not meet your expectation with preorient turned off, turn it on and reevaluate the accuracy/repeatability of your placements.

 

When choosing a lighting level for BGA, C4, or C4-Pattern components, a level of +7 should only be used with side-lighting.

 

 

C4 Types

 

The following restriction applies to programming C4 components on a machine equipped with an AISI 3500 vision system: A maximum of 16 unique C4 components, with 20 programmed features per component, can be contained in a product. This restriction is based on the number and type of programmed C4 features.

 

Placement pressure values above 350 grams are typically used for C4 applications. If the placement head is not C4 capable, these pressures will not be possible.

 

The current bump process is ‘A’, selected as the default. Bump processes B-E are reserved for future UIC vision inspection algorithms.

 

The X or Y Vector value will be ignored if the X or Y Number value equals 1.

 

The % Bumps Required for a C4 component is the percentage of bumps required to return an accurate image.

 

If C4-Pattern is not available from the Component Types list box, you must create a new database. This is done by using the New option under the Database menu bar heading. If desired, existing component definitions can then be brought into the new database using the Merge option.

 

For C4-Pattern, the value for Critical should be chosen as Yes.

 

There should be no entry in the Min Precise Patterns, Pattern Inspection, Location Tolerance X, Location Tolerance Y, or Relative Distance fields.

 

BGA  Types (Requirements and Limitations)

 

A special version of software is needed, developed after an RFQ, for use with UPS 2.x

 

The component can only be processed in a single field of view

 

The appropriate magnification, circular lit camera (circular lit cameras take up 2 additional feeder slots

 

The vision system must be an AIS630 Lantern vision system only.

 

The % Bumps Required for a BGA component is the percentage of bumps required simply to display an image.

 

Missing Ball detection for BGA components

 

Centering – the vision system identifies the defined features (bumps) and determines the x, y, and theta corrections required for an accurate placement. Bump Process A should be chosen in the component definition.

 

Inspection – after the centering process is complete, an additional algorithm is applied to determine if any bumps are missing. When centering and inspection are is desired, Bump Process E should be chosen in the component definition.

This software inspects BGAs for missing balls using a two step approach.  First the regular ball find algorithm is executed and five candidates are selected as potential missing ball sites.  The selection is based on either the failure to locate a ball at an expected site, or a low correlation, or ball recognition score.  Then an intelligent pattern recognition algorithm is trained  on sites which are known to contain good ball images, and the trained algorithm is used to classify the suspect sites and verify the presence/absence of a solder ball.  Various graphic overlays are used during the execution of the algorithm:

 

• It will be necessary to use circular lighting for bump imaging in order to realize optimum reliability. This is because the image quality of balls with the standard lighting is poor.
• This algorithm uses a training method based on balls which are found.  If the image quality is such that noise can be incorrectly labeled as a ball, it is possible to mis-train the algorithm and fail to correctly identify missing balls.
• Only components which fit into a single field of view can be processed.
• In order to switch on missing ball inspection the customer must select “processing type E” in the product editor (the default is A).  This processing type flag is provided to allow for customer defined image processing and in general is not used.  It is expected that using this flag will have no impact on the overall functionality of the machine, since processing types B-D are still available for customer specific tuning.
• This will be a special vision release to support the missing ball inspection.
• The five missing ball candidates are labeled by blue crosses with blue boxes.
• The trained existing balls around the missing ball candidates are labeled by blue crosses only
• The recognized missing ball is labeled by a small red cross on the center of the candidate label

 

If the colored graphics are an annoyance, you can change the Vision Diagnostic Level. The value is probably set at 4 or 5. The range is between 0-5. The lower the value the faster the machine.

 

BGA Type	1.4x UPS Pick and Place Capable	2.x UPS Pick and Place Capable	Special Camera Requirements for inspection	Missing Ball Inspection Capability
CBGA (ceramic)	Yes	Yes	None	Need Analysis
CCGA, White (ceramic-column)	Yes	Yes	None	No
CCGA, Dark (ceramic-column)	Yes	Yes	None	No
uBGA	Yes	Yes	2.6-3.0 Mil/Pixel Camera	Need Analysis
PBGA (plastic)	Yes	Yes	None	Yes
TBGA (taped)	Yes	Yes	Circular Lighting	No

 

Camera	Maximum Single Field of View Size	Minimum Pitch	Minimum Ball Diameter
Super High Mag (0.5 mil/pixel)	4mm (0.160”)	0.125mm (0.005”)	0.075mm (0.003”)
High Mag (1.0 mil/pixel)	10mm (0.39”)	0.25mm (0.010”)	0.125mm (0.005”)
Medium Mag (2.6 mil/pixel)	20.8mm (0.8”)	0.5mm (0.20”)	0.25mm (0.010”)
Medium Mag (3.0 mil/pixel)	24mm (0.8”)	0.5mm (0.20”)	0.25mm (0.010”)
Standard Mag (4.0 mil/pixel)	32mm (1.25”)	0.8mm (0.031”)	0.4mm (0.016”)

 

Leaded Components

 

Lead information must be programmed symmetrically. Information entered for Sides 1 and 2 of the component is input to Sides 3 and 4, respectively. The data can then be edited. To accommodate nonsymmetrical components or components with different lead lengths or pitches, the Lead Groups option may be used.

 

Lead groups can cause additional problems. The drawing always assumes that all leads are present on a side, but does not draw some of them if they were deselected in the leadgroup screen. This can make it difficult for pitches to be adjusted.

 

If 0.0 (zero) is entered in any of the following Tolerance data fields, that inspection is bypassed; Lead Tolerance From Body, Lead Tolerance Across Body, Lead Spacing Tolerance, Lead Length Positive Tolerance, Lead Length Negative Tolerance, Coplanarity Tolerance, and Colinearity Tolerance.

 

If an excessive number of components are rejected, check the component definition relative to vendor specification sheet for the component. Also, use ECS (Enhanced Component Setup) to adjust inspection parameters (geometry, lighting, etc…).

 

Lead Groups

 

The Lead Groups window is not used to toggle leads off for the purpose of increasing the speed of vision inspection (SMC components only). This will only result in a rejected component. All components must be defined as they physically exist. Non-symmetrical leads can be accommodated by defining the component as a Special-Leaded Component.

 

Lead 1 in the component database is not necessarily the component’s electrical pin 1. It is only the first lead in the lower left corner of the component when the component is in the 0° orientation. We define/assign leads as beginning with lead one in the lower left hand corner and count up as we define the part in a counter-clockwise fashion.

 

If you select the Remove All Leads option, all component leads are toggled off and considered to be phantom leads. If a lead was already toggled off when the Remove All Leads option was selected, it would remain off.

 

If you select the Enable All Leads option, all component leads are toggled on and are inspected by the vision system. If a lead was already toggled on when Enable All Leads option was selected, it would remain on.

 

Special Leaded Components

 

Program the component as if all leads on the same side are identical and symmetrical with each other.

When defining a component with different pitches, find the greatest common denominator and enter that as the pitch.

 

The machine memory supports a maximum of 15 lead groups per component.

 

When all lead information is entered, select the Lead Groups option. Select the leads you want to be ignored by the vision system. The leads are now phantomed with just a broken line to indicate their existence.

 

Example:

Let's use the 23pin SMT connector as an example…  There are physically 12 leads on one side of the device and 11 on the opposite side. It would be a reasonable approach to define both sides as having 23 leads with a pitch of 1mm, and turning off every other lead in a manner where the database matches the physical description of the part. However, by turning off every other lead this creates 23 lead groups, and this is why the machine hangs up!

 

We define/assign leads as beginning with lead one in the lower left hand corner and count up as we define the part in a counter-clockwise fashion.  For example, for a 14 pin SOIC, lead # 1 is in the lower left corner and lead # 14 is in the upper left corner (assuming the part is defined with the leads facing north and south).  There are two lead groups when we define a 14 pin SOIC.  Lead group 1 is defined as leads 1-7 and lead group 2 is defined as leads 8-14.  However, if you turn off lead 4 there are now 3 lead groups (lead group 1 = leads 1-3, lead group 2 = leads 5-7, and lead group 3 = leads 8-14).  Notice lead 4 is not included.

 

By turning off every other lead you are creating 23 lead groups. We only have enough RAM on the machine controller to support a maximum of 15 lead groups. However, the number of lead groups is dynamic and can be limited (reduced) by the number of components, component placements, and process complexity.  Therefore, the number of supported lead groups can be £ 15, depending on the product complexity.

 

Program the part as it is…  Assuming the part is coming in tape and the12 leads are facing 6 O'clock and the 11 leads are facing 12 O'clock, let's define the part as having 12 leads on side 1 at a pitch of 2mm and side 3 as having 11 leads at a pitch of 2mm.

 

 

 

 

 

 

 

 

 

 

 

Component Terminology

 

Acronym            Name

 

BGA                   – Ball Grid Array

uBGA                 – micro Ball Grid Array

CBGA                 – Column Ball Grid Array

C4 or Flip Chip   – Controlled Collapse Chip Connection

COB                    – Chip On Board

CSP                     – Chip Scale Package

DCA                   – Direct Chip Attach

FPT                     – Fine Pitch Technology (20 to 40 mil pitch)

ILB                     – Inner Lead Bonding

MCM                  – Multi Chip Module

MELF                 – Metalized ELectrode Face bonded

MSP                    – Mini Square Pack

OLB                    – Outer Lead Bonding

OMPAC              – Over Molded Plastic pad Array Carrier

PBGA                 – Plastic Ball Grid Array

PLCC                  – Plastic Leaded Chip Carrier

PQFP                  – Plastic Quad Flat Package

QFP                     – Quad Flat Package

SOD                    – Small Outline Device

SOIC                   – Small Outline Integrated Circuit

SOJ                     – Small Outline J lead

SOT                     – Small Outline Transistor

SQFP                  – Shrink Quad Flat Package; QFP with a lead pitch of .016” or less

TAB                    – Tape Automated Bonding

TSOP                  – Thin Small Outline Package

UFPT                  – Ulta Fine Pitch Technology (<20 mil pitch)

V-QFP                – Very Small Quad Flat Package

V-SOP                – Very Small Outline Package

 

 

 

Industry Terms

 

CER-QUAD              – Digital Equipment Component

C-QUAD            – Northern Telecom Package

Tape Pak             – Trade Mark/National Semiconductor

V-PAK         – Vertical Package (Texas Instruments – memory package)

 

A | B | C | D | E | F | G | H | I | J | K | L | M | N | O

P | Q | R | S | T | U | V | W | X | Y | Z | NON-LETTER

 

A

 

“A” Wave. Wave, “A”

Å. Angstrom

A/D Converter. Analog-To-Digital Converter

Absorption. The retention of moisture by a substance.

Accelerated Stress Test. A test to deliberately produce a failure.

Acceptable Quality Level (AQL). Maximum number of defects per 100 pieces that are allowable.

Acceptance Tests. Tests deemed necessary to determine the acceptability of products.

Accuracy. (1) The ability to hit the target. (2) Conformity of a measured value to the actual value of the sample.

Acoustic Microscopy. A nondestructive test that produces high resolution ultrasonic images, often used for inspecting component lid seals and die attach within components.

Acrylic. A monomeric acrylate or methacrylate (acrylic acid or a derivative thereof) cured in a polymerization reaction brought on by ultraviolet energy, heat, or a combination of the two.

Acrylic Resin. A thermosetting, transparent, flame resistant resin.

ACS. American Chemical Society

Activated Carbon. A water treatment medium, commonly used for de-chlorination and for reducing organic chemicals and radon from water. Activated Carbon is produced by heating carbonaceous substances (bituminous coal or cellulose-based substances such as wood or coconut shell) to 700罜 or less in the absence of air to form a carbonized char, and then activating (oxidizing) at 800 to 1000罜 with oxidizing gases such as steam and carbon dioxide to form pores, increasing the surface area of this adsorbent material. It can be in block, granulated, or powdered form.

Activated Rosin Flux. Flux, Rosin Activated

Activator. Thermally reactive compounds (such as amine hydrochlorides or various halides) that break down at elevated temperatures and enhance the ability of a flux to remove oxides and other contaminants from surfaces being joined.

Active Components. Electronic components such as semiconductors, transistors, diodes, etc., that can change the characteristics applied electrical signal.

Active Hold-Down. The process of pressing a component lead directly in contact with a bonding pad during soldering to ensure intimate contact between the lead and pad.

Activity. (1) Activities may consist of moving or handling materials and components, changing machine or tool settings, turning equipment on or off, etc. Poorly control of activities can create process variability and varying quality. (2) Flux Activity

ADC. Analog-To-Digital Converter

Additive Plating. Plating, Additive

Adhesion. The state in which two surfaces are held together by interfacial forces which may consist of valence forces or interlocking action.

Adhesion, Mechanical. Adhesion between surfaces in which the adhesive holds the parts together by interlocking action.

Adhesive. A substance capable of holding material together by surface attachment.

Adhesive, Anisotropic. An adhesive with a low concentration of metal particles to permit conduction in the z-axis only.

Adhesive, Conductive. A two part system comprised of a polymer base and a conductive filler.

Adhesive Failure. Failure resulting from insufficient bond between the adhesive and one or both substrates. Adhesive strips away from substrates.

Adhesive Specific. Adhesion between surfaces which are held together by valence forces or molecular bonding.

Adhesive Tensile Loading. When the acting forces are applied at right angles to the plane of the adhesive. The tensile strength of a bond is the maximum tensile load per unit area, required to break the bond expressed in pounds per square inch.

Adhesive, Thermoplastic melt on application. The process is reversible.

Adhesive, Thermoset undergo a chemical change during heating. The change is not reversible. Epoxies and acrylics are thermosets.

AFM. See atomic force microscope.

Ag. Chemical symbol for the element silver.

Aging. The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.

Air Knife. (1) A mechanical air pressure amplifier. (2) A plenum with a narrow opening used develop high velocity air from a low pressure air source to (a) dry / remove liquid films from surfaces (b) control the coating of surfaces, or (c) heat or cool.

Algorithm. A set of rules specifying a sequence of actions taken to solve a problem.

Alignment Hole. Tooling Hole

Alloy. A substance made by melting two or materials together.

Alumina. A common substrate material composed of approximately 95% Al2O3.

Ambient Level. The values of signals and noise that exist at a test location when the device under test is not active.

Amorphous Phase. Non-crystalline. Most plastics are amorphous at processing temperature. Many retain this strength under normal temperatures.

Analog Circuit. An electrical circuit that provides a continuous relationship between its input and output.

Analog-To-Digital Converter (ADC or A/D converter). An electronic circuit that produces a digital output directly proportional to an analog signal input.

Anechoic Chamber. An enclosure especially designed with walls that absorb sound or radiation, creating an essentially free-field environment for testing.

Angle Of Attack. The angle between the squeegee and the stencil or screen.

Angstrom. A unit of length equal to one hundred-millionth (10^-8) of a centimeter, often used to specify radiation wavelengths.

Anion. An ion with a negative charge. An anion [such as chloride (Cl-), nitrate (NO3-), bicarbonate (HCO3-), or sulfate (SO4–)] may result from the dissociation of a salt, acid, or alkali.

Anion Exchange. Ion Exchange. A water conditioning process.

Antioxidants. Compounds that retard the rate of oxidation of a polymer.

Anisotropic. Exhibiting different physical properties in different directions.

Anisotropic Adhesive. Adhesive, Anisotropic

Annular Ring. The pad area that remains after a hole is drilled through the pad.

ANSI. American National Standards Institute

Antistatic Materials resist turbocharging more than ?00 volts.

Anti-Pad. The area of copper etched away around a via or a plated through-hole on a power or ground plane, thereby preventing an electrical connection being made to that plane.

AOI. Automated Optical Inspection

Application-Specific Integrated Circuit (ASIC). An IC device whose function is designed for a specific application(s).

Aperture. An opening in a stencil or screen.

Aperture, Chemical Etched. An opening in metal stencil created by coating the metal foil with photoresist, exposing an image both sides the resist using a phototool, and etching the foil from both sides.

Aperture, Electroformed. An opening in stencil formed by imaging a photoresist on a substrate and then plating the nickel foil around the resist to the desired thickness.

Aperture, Electropolished. An electrolytic post-process that “smooths” the walls of aperture walls to improve solder paste printing.

Aperture Files. Precise x-y location and shape of all apertures required on a printed circuit board.

Aperture, Laser Cut. An opening in a metal stencil created by using Gerberâ and aperture data to position a laser cutting head.

Aperture, Trapezoidal. An aperture with the board side opening 1 to 2 mils larger than the squeegee side opening.

API. Application Program Interface

Application Program Interface. The interface between the application’s software and the application platform.

Application Software. A program that performs a specific service or solves a particular problem.

AQL. Acceptable Quality Level

Aqueous. A water soluble.

Aqueous Cleaning. Cleaning, Aqueous

Architecture. A structured set of protocols that implement the functions of the system.

Array. A group of components arranged on rows and columns.

Artwork. A phototool used to create (1) features during printed circuit board fabrication or (2) apertures on a screen or a chem-etched stencil.

Artwork Generation. The process of transferring the CAD circuit layout to reproducible artwork for use by stencil and printed circuit board fabricators.

Artwork Master. Artwork used to produce production masters.

ASIC. Application Specific Integrated Circuit

ASME. American Society of Mechanical Engineers

Aspect Ratio. (1) Thickness of a printed circuit board to the diameter of the smallest hole. (2) Thickness of a stencil to the width of the smallest aperture.

Assembler. A program that translates mnemonics into binary codes that run on a computer.

Assembly. A functional subdivision of a component, consisting of parts or subassemblies that perform functions necessary for the operation of the component as a whole. Examples: regulator assembly, power amplifier assembly, gyro assembly, etc.

AST. Accelerated Stress Testing

ASTM. American Society for Testing and Materials

Asynchronous. An action that takes place at an arbitrary time, without synchronization to a reference timer or clock.

ATE. Automatic (Automated) Test Equipment

Atm. Atmosphere pressure

Atomic Force Microscope (AFM). A microscope that works by bringing a fine needle right up to the surface of a semiconductor and tracing the topography of the material. AFMs are an alternative to scanning electron microscopes as a means of measuring and monitoring the widths and heights of critical dimensions on an integrated circuit die.

Au. Chemical symbol for the element gold.

Automated Optical Inspection (AOI). A mechanized visual inspection process.

AWG. American Wire Gage

Axial Lead. Lead wire extending from a component or module body along its long axis.

Axial Leaded Components are usually cylindrical in shape and have leads exiting from opposite ends along its long axis.

Azeotrope. A liquid mixture with a constant maximum or minimum boiling point lower or higher than the boiling points of its components and with the capacity to distill without change in composition.

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B-Stage Resin. An intermediate stage in curing a thermoset resin. Prepreg

Back End Of The Line (BEOL). Test, assembly, and packaging of wafer manufacturing.

Ball Bonding. Bonding, Ball

Ball Grid Array (BGA) is surface mount technology IC package that provides electrical advantage of shorter signal and power paths and the mechanical advantage of greater interconnects and higher lead pitch, while decreasing package size.

Bare Board. An unpopulated printed circuit board.

Bare Die. An unpackaged integrated circuit.

Barrel. The cylinder formed in the drilled through hole in a printed circuit board.

Base Board. Base Material

Base Material. In printed circuit board fabrication, the insulating laminate where the conductor pattern is formed.

Batch. An entity that represents the production at any point in the process. A batch is a running control recipe. The material that is being produced or that has been produced by a single execution of a recipe is also considered a batch.

Batch Control. Consists of a sequence of one or more steps (phases) that must be performed in a defined order for a finite period of time to process finite quantities of input material to produce finished product.

Batch Manufacturing. Manufacturing in groups, lots or batches in which each part or finished good is identical.

Batch Processing. The method adopted when the required product volumes do not allow continuous production of one product on particular machines.

BBA. Bus Ball Array

Bed-Of-Nails. A test fixture, used with (automated) test equipment, made of spring loaded contact pins (Pogoâ pins) located to correspond with desired measurement points (nodes) on a printed circuit board.

Bend Radius. The radius at the inside of the bend at (1) the lead shoulder leading to the leg and (2) the base of the leg leading to the foot.

BEOL. Back End Of The Line

BGA. Ball Grid Array

Bi. Chemical symbol for the element bismuth.

Bifurcated Terminal. Terminal, Bifurcated

Binder. Materials added to pastes and adhesives to provide strength for handling purposes.

Binning. Classifying components by their performance at the final test. The analogy is to physically drop things into different bins.

Bipolar. (1) A signal that includes positive and negative values. (2) A type of semiconductor.

Birdcage. A defect in stranded wire where the strands in the stripped portion between the covering of an insulated conductor and a soldered connection (or an end-tinned lead) have separated from the normal lay of the strands.

BIST. Built-In Self Test

BIT. Built-In Test

Blind Via. Via, Blind

Blister. Raised areas on the surface of the laminate caused by the pressure of volatile substances entrapped within the laminate.

Blow Hole. A cavity in the solder surface whose opening has an irregular and jagged form, without a smooth surface.

Board. Printed Circuit Board

Board-Level (Circuitry) Repair. Repair, Board-Level (Circuitry)

BOD. Biological Oxygen Demand

Bond Strength. The force per unit area required to separate two adjacent layers of a package. The force is applied perpendicular to the surface of the package.

Bonding. Joining of two materials.

Bonding Alloy. Solder

Bonding, Ball. A wire bonding method that melts a sphere of gold wire, melts the sphere at the first connection point, draws a loop in the wire, and makes a wedge bond at the other connection point.

Bonding, Die. The attachment of an integrated circuit chip to a substrate.

Bonding Pad. Pad. Termination

Bonding, Tape. Using a metal or plastic tape material to support the carrier of a component in a gang bonding process.

Bonding, Thermocompression. Machines that use pressure and heat in the absence of electrical current and without an intermediate material to form wire bonds.

Bonding, Thermosonic. Machines that use heat (typically 150罜), ultrasonic energy, force, and time to form wire bonds.

Bonding, Ultrasonic. Machines that use ultrasonic energy, force, and time to form wire bonds.

Bonding, Wedge. A wire bonding method that can use either gold or aluminum wire. Aluminum wedge bonds are made with ultrasonic bonding machines. Gold wedge bonds are made using thermosonic bonding machines.

Bonding, Wire. A die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. Ball and wedge bonding are primary wire bonding methods, of which ball bonding is more common.

Boundary Scan. A functional test designed into integrated circuits.

Bow. A cupped variation from a known flatness of a printed circuit board.

Breakaway Tabs. Excess material left on printed circuit boards during fabrication to improve board handling that is removed after assembly.

Breakout. Poor registration between the hole and the pad on a printed circuit board to the degree that the hole is not within the area of the pad.

Bridging. A buildup of solder between components, conductors, and/or base substrate forming an undesired conductive path.

British Standards Institute (BSI). A standard setting organization.

BSI. British Standards Institute

Buffer. A solution that minimizes changes in hydrogen ion concentration that would otherwise occur as a result of a chemical reaction.

Built-In Self Test (BIST). Test, Built-In

Built-In Test (BIT). Test, Built-In

Bulk Components. Packaging with loose chip or MELF components that with a special feeder present the parts the pick and place head.

Bump. A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.

Buried Via. Via, Buried

Burn-In. An accelerated stress test run at elevated temperature to weed-out marginal components.

BPA. Bus Pad Array

Butt Lead Package. I Lead Package.

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C4. Controlled Collapse Chip Connection

C5. Controlled Collapse Chip Carrier Connection

C-Stage Resin. A resin in the final stage of curing.

CAD. Computer Aided Design

CAGR. Compound Annual Growth Rate

CAM. Computer Aided Manufacturing

Camera, Component. An upward looking camera used to determine part position offsets required for proper placement.

Camera, Fiducial. A downward looking camera in the placement head used to determine position of the printed circuit board relative to the head. Or vice versa.

Canadian Standards Association (CSA). A Canadian safety standard certification organization.

Capability. Process Capability

Capability Ratio. Cp

Capability Ratio, Centered. Cpk

Capacity Buy. Buying of equipment to increase manufacturing capacity, as opposed to a technology buy.

Capillary Action. A flow of a fluid against gravity between solid surfaces.

Card. Printed Circuit Board

Carrier Tape. Tape, Carrier

CASE (Tools). Computer-Aided Software Engineering.

Castellation. Metalized features that are recessed on the edges of a chip carrier, which are used to interconnect conducting surfaces or planes within a chip carrier or on the chip carrier.

Catalyst. A chemical that changes the rate of a chemical reaction.

Cation. A positively charged ion in an electrolyte solution, attracted to the cathode under the influence of a difference in electrical potential. Sodium ion (Na+) is a cation.

Cation Exchange. Ion Exchange. A water conditioning process, commonly used for water softening.

Cation Exchange Resin. Cation exchanger. Base exchanger. An ion exchange material possessing reverse exchange ability for cations. Sulfonated polystyrene copolymer divinylbenzene (DVB) exchange resin is used almost exclusively today in ion exchange water softeners.

CBGA. Ceramic Ball Grid Array

Chip Carrier

CCGA. Ceramic Column Grid Array

Centered Capability Ratio. Cpk

Centering. Correcting the actual center of a part on a nozzle after picking to the true center of the nozzle.

Centering, Mechanical. Repositioning a part on a nozzle after it has been picked using spring-loaded jaws that close around the part and move it to the proper position.

Centering, Vision. Using a camera to determine position offsets to compensate for the location of the part on the nozzle.

Ceramic. An inorganic, nonmetallic material, such as alumina, beryllia, steatite, or forsterite, which is fired at a high temperature. Ceramics are used in electronics as a substrate or to create component packages.

Ceramic Ball Grid Array (CBGA). A ball grid array (BGA) package of cofired alumina ceramic substrate allowing various lid sealing and encapsulation techniques.

Ceramic Column Grid Array (CCGA). A ceramic ball grid array (CBGA) with solder columns replacing the solder balls.

Certification. The act of verifying and documenting that personnel have completed required training and have demonstrated specified proficiency and have met other specified requirements.

CFC. Chlorinated Fluorocarbon (Chlorofluorocarbon)

CFR. Code of Federal Regulation

CGA. Column Grid Array

Chelating Agent. This agent forms a bond with the ions, such as calcium and magnesium ions and prevents precipitation of calcium and magnesium salts as hard water.

Chelation. The mechanism by which chemicals that would otherwise precipitate are complexed in solution with a chelating agent.

Chemical Etched Aperture. Aperture, Chemical Etched.

Chemical Etched Stencil. Aperture, Chemical Etched.

Chemical Vapor Deposition (CVD). Deposition of thin films (usually dielectrics/insulators) on silicon wafers by placing the wafers in a mixture of gases which react at the surface of the wafers.

Chem-Etched. Chemical(ly) Etched.

Chip. (1) Chip Component. (2) Integrated Circuit. (3) Bare die.

Chip Carrier. A low profile four sided (rectangular) part package, whose semiconductor chip cavity or mounting area is a large fraction of the chip size.

Chip Component. A SMT passive device, including resistors, capacitors, and inductors.

Chip On Board (COB). An unpackaged silicon die mounted directly on the printed circuit board and connected with wire bonds.

Chip Scale Package. A popular description is that a CSP must be no more than 120% the X and Y dimensions of the silicon die within the package. So, the CSP is a die on a carrier substrate. In order to maintain the CSP die to package ratio the CPS is generally a ball grid array. So, this description becomes fuzzy because CSP fabricators routinely shrink the die to reduce cost, but generally do not change packaging.

Chip Shooter. A high speed surface mount component handler and placer.

Chlorofluorocarbon (CFC). A chemical that was used in the electronic, chemical, and refrigeration industries.

CIM. Computer Integrated Manufacturing

Circuit. Circuitry

Circuit Width. Conductor Width

Circuitry. The configuration or design of the conductive material on the base material. This includes conductors, lands, and through connections when these connections are an integral part of the manufacturing process.

Circuitry-Level Repair. Repair, Board-Level (Circuitry)

Circumferential Separation. A crack or void in the plating extending around the entire circumference of a PTH, or in the solder fillet around the conductor, in the solder fillet around an eyelet, or at the interface between a solder fillet and a land.

Clamshell (Fixture). A two sided test fixture that opens like a book (clamshell) to accept the printed circuit board or assembly for testing.

Class XXXX Clean Room. A clean room rating system. For instance, a Class 100,000 Clean Room limits the particle count to less than 3500 particles per liter (100,000 particles per cubic foot) of a size of 0.5 micron or larger, or 25 particles per liter (700 particles per cubic foot) of a size 5.0 microns or larger.

CLCC. Ceramic Leaded Chip Carrier

Clean Room. An enclosed room employing control over particulate matter in the air with temperature, humidity, and pressure controls.

Cleaning. The process of removing flux residues and other contaminants from the surface of a printed circuit assembly.

Cleaning, Aqueous. Cleaning parts with water (e.g., tap, pure, or de-ionized) as the primary cleaning fluid.

Cleaning, Manual. Spot cleaning flux residues from assembly surfaces, usually using a brush and isopropyl alcohol as the cleaning agent or solvent.

Cleaning, Plasma. A bonding pad preparation process that uses electrically excited gas molecules to remove surface contamination.

Cleaning, Semiaqueous. A cleaning process using a solvent followed by a hot water rinse and drying.

Cleaning, Solvent. A cleaning process using chlorinated and fluorinated hydrocarbon liquids.

Cleaning, Ultrasonic. A cleaning process using ultrasonic energy (mechanical oscillation ) along with a chemical solvent.

Cleaning, Vapor Degreaser. A cleaning process where a heated solvent is condensed on the printed circuit board to be cleaned.

Client. A software application which communicates with another software application (the server). The server normally supplies data or functions to the client.

Clinched Lead. A pin through hole lead that is bent on the solder side of the printed circuit board to hold the component in place prior to soldering.

Contract Manufacturing (Manufacturer)

CMOS. Complementary Metal Oxide Semiconductor

CMS. Contract Manufacturing Services

Coating. A thin layer of conductive or dielectric material applied over components or a base material.

COB. Chip On Board

Cohesive Failure occurs when internal strength of the adhesive is not as great as the forces applied to it. Adhesive remains bonded to both substrates.

Coefficient of Thermal Expansion (CTE). The ratio of change in dimension per unit change in temperature.

Cofire. A process for forming multilayer ceramic substrates in which thick-film conductors and dielectrics are simultaneously processed by a firing cycle.

Cold Flow. Movement of insulation (e.g. Teflon) caused by pressure. Creep.

Cold-Junction Compensation. An artificial reference level that compensates for ambient temperature variations in thermocouple circuits.

Cold Solder Joint. Solder Joint, Cold

Colloid. A substance that remains suspended in a solution or fails to settle out of solution.

Column Grid Array (CGA). A packaging technology similar to a pin grid array, in which a device’s external connections are arranged as an array of conducting pins on the base of the package. However, in the case of a column grid array, small columns of solder are attached to the conducting pads.

Comb Pattern. Two sets of interconnected interspaced finger-like arrays of uniformly spaced conductors. SIR testing requires comb patterns on printed circuit boards.

Combinational Testing. Test, Combinational

Compiler. A program that translates high-level-language statements into codes that a computer can execute.

Component. (1) A functional subdivision of a system, generally a self-contained combination of assemblies performing a function necessary for the system’s operation. Examples: power supply, transmitter, gyro package, etc. (2) A part of an assembly or subassembly. A part.

Component Camera. Camera, Component

Component Hole. Plated-Through-Hole (PTH)

Component Lead. A wire or formed conductor extending from a component and serving as a mechanical and/or electrical connection.

Component-Level Repair. Repair, Component-Level

Component Side. Primary side

Composite. A resin combined with another material, such as glass fiber, to improve physical properties.

Computer Aided Design (CAM). A design method that uses computer generated images, rather than mechanical drawings.

Computer-Aided Software Engineering (CASE) Tools allow users to make changes in the way they access information from a relational data base.

Computer Integrated Manufacturing (CIM). Linking computer aided design data to the computer controlled assembly and test equipment used to produce the product.

Conductive Adhesive. Adhesive, Conductive

Conductive Material. Electrostatic Conductive Material

Conduction (Soldering). Soldering, Conduction

Conductor. A lead, solid or stranded, or printed wiring path serving as an electrical connection.

Conductor Spacing. The distance between traces on a printed circuit board.

Conductor, Thermal. Thermal Conductor

Conductor Thickness. The thickness of the conductor including all metallic coatings, excluding non-conductive protective coating.

Conductor Width. The observable width of a circuit or conductor at any point chosen at random. The width is measured from directly above.

Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection.

Conformity. The ability to satisfy specified requirements.

Connection. An electrical termination that was soldered. A solder joint.

Connection, Interlayer. An electrical connection between conductive patterns in different layers of a printed circuit board. Via

Construction Analysis. Destructive Physical Analysis (DPA). The process of destructively disassembling, testing, and inspecting a device for the purpose of determining conformance with applicable design, process, and workmanship requirements.

Contact Angle. Wetting angle. The angle of wetting between a solder fillet and the pad or component lead. A small contact angle indicates good wetting, and a large angle indicates poor wetting.

Contact Resistance. The maximum resistance allowed between a pin and the socket contacts of a connector when assembled and in use.

Contaminant. An impurity or foreign substance present in a material that affects one or more properties of the material. A contaminant may be or not be ionic.

Control Chart. A chart for tracking a series of measurements taken over time.

Control System. A system to guide or manipulate various elements in order to achieve a prescribed result.

Convection. Transfer of energy (heat) by the circulation of a fluid or gas.

Conveyor. A machine that supports a printed circuit board and moves it from one location to another.

COO. Cost Of Ownership

Coplanarity. The vertical spread in the measurement of the lowest and highest contact (“out-of-line”) of a package.

Copper Tin Intermetalic. Intermetalic, Tin Copper

Core Material. In printed circuit board fabrication, fully cured inner layers of a multilayer printed circuit board.

Core Solder. Solder, Wire/Core

Corrosion. The chemical reaction of a metal in contact with the air.

COTS. Commercial Off The Shelf

Coupon. A portion of a printed circuit board used for testing.

Court Yard. The keepout area of a surface mount component.

Cover Tape. Tape, Cover

Cp. Capability Ratio. Measurement of the width of the distribution of process measurements, compared to a desired point.

Cpk. Centered Capability Ratio. Measurement of the mean of process measurements, compared to a desired point.

Crazing. An internal condition occurring in the laminate base material in which the glass fibers are separated from the resin, caused by mechanical stress.

Creep. Cold Flow

Critical Dimension (CD). The minimum width that is allowed as part of the circuit design, on any given patterning layer.

Critical Path Method. A technique to determine the order in which operations must be executed to complete a project in minimum time, and determine which operations have some “float” or capacity to be rescheduled without affecting the minimum time.

CRT. Cathode Ray Tube

Crystallinity. A state of molecular structure in some polymers denoting uniformity and compactness of the molecular chains.

CSA. Canadian Standards Association

CSP. Chip Scale Package

CSP-C. Ceramic Chip-Scale Package

CSP-L. Laminate Chip-Scale Package

CTE. Coefficient of Thermal Expansion

CTE Mismatch. The difference in the CTE of two materials or components joined together. This mismatch can produce strains and stresses at joining interfaces or in attachment surfaces.

Cu. Chemical symbol for the element copper.

Cup Terminal. Terminal, Cup

Cure. A heat, catalyst, or pressure activated chemical reaction that changes the physical properties of a material.

Curing Cycle. The time-temperature profile needed to cure a thermosetting material like a bonding adhesive.

Curing Time. The time needed to cure a thermosetting plastic material.

Cycle Rate. A dry run time.

CVD. Chemical Vapor Deposition

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DAC or D/A Converter. Digital-To-Analog Converter

DARPA. Defense Advanced Research Projects Agency

Data Acquisition System. Any device that acquires information from sensors using amplifiers, multiplexers, and analog to digital converters.

DCA. Direct Chip Attach

DCS. Distributed Control System

DDA. Direct Die Attach

DDE. Dynamic Data Exchange

Defect. Any nonconformance to specified requirements by a unit or product.

Definition. Degree that a produced pattern matches the master pattern.

Defluxing. Cleaning. Removing flux residues after a soldering operation.

Degradation. Destructive change in the chemical structure of a plastic reflected in its appearance or physical properties.

Degreasing. Cleaning. Removing wave oil and flux residues after a soldering operation.

Deionized (DI) Water. A pure form of water with no ionized material.

Delamination. A separation of the bonded layers or foils of a laminated material, such as a printed circuit board.

Dendrite. Metallic filaments growing by electromigration between two points.

Density. The weight of a material in relationship to its volume.

Deposition. The process of applying a material on a substrate by applying pressure through a screen or stencil.

Desiccant. A substance, such as calcium oxide or silica gel, with a high attraction for water and is used as a drying agent.

Desiccant Cabinet. A nitrogen atmosphere storage area for moisture sensitive parts.

Design Of Experiments (DOE). A statistical technique for determining the relationship between and relative importance of various factors controlling a process.

Design Rules. Allowable dimensions, keepout areas, and tolerances used in the layout and design of circuitry.

Desoldering. A disassembly method of removing the solder from components on a printed circuit board.

Detergent. A product designed to make materials, often oils and greases, soluble in water. Usually, detergents are made from synthetic surfactants.

Deviation. A specific authorization, granted before the fact, to depart from a particular requirement of specifications or related documents.

Device. Component

Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimately with one or more the components. Characterized by an abrupt boundary between the solder and the component lead or conductor. Can be distinguished by a “rolling back” of the solder from the lead or conductor.

DFA. Design For Assembly

DFT. Design For Test

DI (Water). Deionized water.

Diazo. A type of artwork film.

Die. Integrated circuit chip as diced or cut from the finished wafer.

Die Attach. Bonding a die to its mount in its package. This is often done with a metal based glue-like silver epoxy for good conduction of heat away from the chip.

Die Bonding. Bonding, Die

Dielectric. Nonconducting material used to encapsulate circuitry and in the manufacture of capacitors and printed circuit boards.

Dielectric Constant. That property of a dielectric which determines the electrostatic energy per unit volume for unit potential grade.

Dielectric Strength. The voltage at which an insulating material can withstand before breaking down occurs, usually expressed as volts per mil.

DIP. Dual Inline Package

Diffusion. A material transport phenomena that occurs in solids, and is caused by the continual physical motion of atoms from one position to another. This results in the flow of material from regions of high concentration to regions of low concentration.

Digital. A type of circuit in which the signals can have only one of two possible states, a “1” or a “0”.

Digital-To-Analog Converter (DAC or D/A Converter). A device that converts digital information into a corresponding analog voltage or current.

Dikes. Side Cutter

Direct Chip Attach (DCA). Chip-on-board technology.

Direct Die Attach (DDA). Direct Chip Attach

Direct Memory Access (DMA). The direct transfer of information between a computer’s memory and a device while the computer’s CPU does something else.

Discrete Components. Individual resistors, capacitors, diodes etc.

Dispense (ing). A machine or manual method of applying solder paste, adhesives, and other gels using air or mechanical pressure to force the material being dispensed through a nozzle or tip onto a substrate.

Dispersants. Organic and inorganic phosphates and polymers used in aqueous cleaning to assist in the removal of insoluble materials.

Dissipation Factor. The tangent of the loss angle of the insulating material.

Dissipative Material. Electrostatic Dissipative Material

Dissociation. The separation of an electrolyte into ions of opposite charge.

Distributed Control System (DCS). A real-time control system for continuous and batch process applications.

Distributed Processing. The physical and/or logical connectivity of hardware, software, information and load sharing.

Disturbed Solder Joint. Solder Joint, Disturbed

Divinylbenzene (DVB). A widely used cation exchange resin.

Document Management System. Provides storage, retrieval and manipulation of documents in a compact space.

DOE. Design Of Experiments

Double-Sided Assembly. A printed circuit assembly with components on both sides of the substrate.

Double Sided Reflow Soldering. Reflow Soldering, Double Sided

Down Force. Squeegee Pressure.

DMA. Direct Memory Access

DPA. Destructive Physical Analysis or Construction Analysis

DPM. Defects Per Million (opportunities)

DRAM. Dynamic Random Access Memory

Draw Bridge. Tomb Stone

Drill Files. Precise x-y location and sizes of all holes required on a printed circuit board.

Drill Wander. In printed circuit board fabrication, deviation from the target drilling location.

Dry Etching. Plasma Etching

Dry Run (ning). Operating a machine without processing. For instance, dry running a placement machine sequentially moves the head to the feeders and the component placement locations.

Dross. Chiefly tin oxide, but contains oxidized lead and other contaminants that form on the surface of molten solder.

Dross Content. A measure of the cleanliness of solder powder.

DSP. Digital Signal Processor

Dual Inline Package (DIP). A PTH package with two parallel rows of leads extending from the base of the component. Standard lead pitch is 0.100 inch.

Dry Film (Solder Mask). Solder Mask, Dry Film

Dual Gantry. A machine positioning system with two independent gantries.

Dual Wave Soldering. Soldering, Dual Wave

Dummy Component. A non-functional component package.

Dummy Land. A conductor on a printed circuit board that is not connected electrically to other circuitry.

Dummy Pad. Pad, Dummy

Durometer. A measure of the hardness of a non-metal.

DVB. Divinylbenzene

Dynamic Data Exchange. DDE is a communication protocol that allows Windows® programs to communicate with each other.

A | B | C | D | E | F | G | H | I | J | K | L | M | N | O

P | Q | R | S | T | U | V | W | X | Y | Z | NON-LETTER

 

E

 

Edge Connector. The portion of the PCB used to provide external electrical connection.

Edge Clearance. A keepout area on the side and each ends of printed circuit boards required for board handling.

EDS. Energy Dispersive Spectrograph

EIA. Electronic Industries Association

EIAJ. Electronic Industries Association of Japan

Elastomeric. A material that at room temperature can be stretched repeatedly to at least twice its original length, and upon release of the stress, will return with force to its approximate original length. Rubber band material is elastomeric.

Electrochemical Migration. An unplanned electrolytic plating process. A film of polar solvent, often water, on a substrate surface provides for current flow between points with a difference in electrical potential.

Electrode. A conductor through which a current enters or leaves an electrolytic cell, vacuum tube, or any nonmetallic conductor.

Electroformed Aperture. Aperture, Electroformed

Electroformed Stencil. Stencil, Electroformed

Electroless Nickel – Immersion Gold. A coating applied during printed circuit board fabrication to protect copper features from oxidation.

Electroless Plating. Plating, Electroless

Electrolyte. Compounds that conduct an electric current by the movement of ions.

Electrolytic Corrosion. Corrosion by means of electrochemical action.

Electrolytic Plating. Plating, Electrolytic

Electromagnetic Compatibility (EMC). (1) The ability of electronic equipment to operate in an intended electromagnetic environment without degradation caused by interference. (2) The ability of equipment to operate in its electromagnetic environment without creating interference with other equipment.

Electromigration. Electrochemical Migration

Electroplating. Electroless Plating.

Electropolished Aperture. Aperture, Electropolished

Electropolished Stencil. Stencil, Electropolished

Electrostatic Conductive Material. Material with a surface resistivity of 10 ohms per square maximum.

Electrostatic Discharge (ESD). The transfer of a charge when the two objects have different electrostatic potentials. The potentials can be caused by either direct contact or induced by an electrostatic field. In electronic manufacturing, the employee working on a printed circuit board and a component on the same board can have different electrostatic potentials, which will damage electronic components.

Electrostatic Dissipative Material. Materials with a surface resistivity greater than 10^5, but less than 10^12 ohms per square.

Electrostatic Field. A voltage gradient between an electro-statically charged surface and another surface of a different electrostatic potential.

Electrostatic Insulating Material. Materials with a surface resistivity greater than 10^12 ohms per square.

Elevator, Tray. Feeder, Tray

Elongation. The fractional increase in length of a material stressed in tension.

Embossed Tape. Tape, Embossed

EMC. Electromagnetic Compatibility

EMI. Electromagnetic Interference

EMS. Electronic Manufacturing Services

Emulsifier. An aqueous additive used to keep soils dispersed throughout the cleaning fluid.

Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositing solder paste on the printed circuit board.

Encapsulating. Potting. Enclosing an article in an envelope of adhesive.

Encapsulating Compound. An electrically nonconductive compound used to completely enclose and fill in voids between electrical components or parts.

Encoder. A precision glass or metal ruler mounted on the frame of a machine that is used to measure the location of a moveable head. Encoders can be either linear or rotary.

ENIG. Electroless Nickel – Immersion Gold

Enterprise Resource Planning (ERP). A logistical extension of MRP.

EPBGA. Enhanced Plastic Ball Grid Array

Epoxy. A polymer thermosetting resin used to bond materials.

Epoxy Resin. A material that forms straight chain thermoplastic and thermosetting resins. Epoxy resins have excellent mechanical properties and good dimensional stability.

EPROM. Electronic Programmable Read Only Memory

ERP. Enterprise Resource Planning

ESD. Electrostatic Discharge

ESD Sensitive. Electrical and electronic parts, assemblies and equipment that could be damaged by ESD voltages.

ESDS. Electrostatic Discharge Sensitive

Etch Factor. The ratio of etch depth to the amount the resist is undercut during etching.

Etching. The process of selectively removing any material not protected by a resist using an appropriate solvent or acid.

Ethyline Vinyl Acetate Resins (EVA). Co-polymers of the polyolefins family derived from random co-polymerization of acetate and ethylene.

Eutectic. An alloy with a lower melting point lower than the melting points of its components. 63% tin and 37% lead (63Sn/37Pb) solder is referred to as eutectic solder. Eutectics change directly from liquid to solid, and the reverse, with no intermediate plastic states.

EVA. Ethyline Vinyl Acetate Resins.

Event Counter. A circuit that counts the occu

 

A list of some domestic market eyelet suppliers follows. It is not comprehensive and is not an endorsement of particular suppliers. The first suppliers listed are those which seem to be most frequently associated with Auto Insertion projects.

Stimpson Co., Inc.
Bayport, NY 11705-1097 USA
Phn 516-472-2000
Fax 516-472-2425

Round, Oval, Oblong, Square Shoulder, Closed-End Telescoping, Tongue, Over 3,250 Different Styles and Sizes, Hand, Foot and Automatic Eyeletting Machines, Snap Fasteners, C-E Rivets, Ferrules, Fasteners and Automatic Attaching Machines. Assembly Service Department will assemble your article with the appropriate fastener and submit with prices.

PCI Group, Inc.
New Bedford, MA 02741 USA
Phn 800-232-2346
Fax 508-995-4950
Cust Serv Fax 508-998-7446

Precision Industrial Fasteners, Industrial Eyelets, Shoe Eyelets, Grommets and Washers. Eyelet/Grommet Setting Tools, Eyelet/Grommet Insertion Machinery, Metal Stampings.

Mark Eyelet
63 Wakelee Road
Wolcott, CT 06716
Phn 203-756-8847
Fax 203-755-9410

Highland Mfg Co., The – Waterbury, CT
Cly-Del Manufacturing Co., The – Waterbury, CT
Braxton Mfg. Co., Inc. – Watertown,CT
Stimpson Co., Inc. – Bayport, NY
Platt Bros. & Co., The – Waterbury, CT
PCI Group, Inc. – New Bedford, MA
Carby Corp., The – Watertown, CT
Utitec, Inc. – Watertown, CT
Perterson Manufacturing Co., Inc. – Sarasota, FL
International Eyelets, Inc. – Vista, CA
Gem Manufacturing Co., Inc. – Waterbury, CT
Trans-Matic – Holland, MI
National Die Company, The – Wolcott, CT
Eyelets For Industry, Inc. – Thomaston, CT
Stevens Company, Inc. -0 Thomaston, CT
WTM Company, Inc. – Thomaston, CT
Auto-Form, Inc. – Waterbury, CT
Demsey Mfg. Co., Inc. – Watertown, CT
Zero Stamping Co., Inc. – Taylor, MI
Twinplex Mfg. Co. – Wood Dale, IL
Howard Engineering Co., Inc. – Naugatuck, CT
Nutmeg Eyelet & Stamping Co., Inc. – Naugatuck, CT
Hylie Products, Inc. – Watertown, CT
Bouffard Metal Goods, Inc. – Watertown, CT
Truelove And Maclean, Inc. – Waterbury, CT
Line Manufacturing Inc. – Waterbury, CT
Prospect Machine Products Inc. – Prospect, CT
Accurate Forming A Tyco International Ltd., Co. – Hamburg, NJ
Semco Tool & Mfg. Co. – Naugatuck, CT
Presspart, Inc. – Cary, NC
Superior Eyelets, Inc. – Waterbury, CT
Advance Stamping Co. – Detroit, MI
Jo-Vek Tool & Die Mfg. Co., Inc. – Waterbury, CT
Marga Service Co. – Bethany, CT
Olympic Tool – Redford, MI
Preyco Manufacturing Co., Inc. – Waterbury, CT
Gary Industries Inc. – Bethany, CT
Electronic Eyelet & Interconnect, Inc. – San Jose, CA
Metaltec, Div. of Technology General – Franklin, NJ
Automatic Drawn Products Inc. – Skokie, IL
FPC Corporation – Wauconda, IL
G & J Steel & Tubing Inc. – Somerville, NJ
Thompson Machine:The Tool & Die Group, Inc. – Albuquerque, NM
Segal, Edward, Inc. – Thomaston, CT
Gabriel Mfg. Co., Inc. – Stony Point, NY
Fastener Dimensions, Inc. – Ozone Park, NY
Gasser & Sons, Inc. – Commack, NY
Production Tube Cutting, Inc. – Dayton, OH
Columbia Nut & Bolt Corp. – Moonachie, NJ
Eagle Alloys Corp. – St. James City, FL
Arens Controls, Inc. – Evanston, IL
Ball Chain Mfg. Co. Inc. – Mount Vernon, NY
L.C.S. Company – St. Paul, MN
All-Tex Industries, Inc. – Chicago, IL
Roselle Precision Products Inc. – Berkeley Heights, NJ
Marion Mfg. Co., The – Cheshire, CT
Cornell Mfg. Co., Inc. – Orangeburg, NY
Carpin Mfg. Inc. – Waterbury, CT
OEM Fastening Systems – Norcross, GA
Falcon Metal Corp. – Charlotte, NC
Mohawk Manufacturing Co. Middletown, CT
International Metal Products Corp. – Avon, CT
Ultimate Hydroforming, Inc. – Sterling Heights, MI
Automatic Turning & Machining Inc. – Kersey, PA
Johnson & Hoffman Mfg. Corp. – Carle Place, NY
Metallon, Inc. – Thomaston, CT
Autoswage Products, Inc. – Shelton, CT
Anomatic Corp. – Newark, OH
Active Screw & Fastener – Elk Grove Village, IL
Thoroughbred Metals, Inc. – Green Brook, NJ
Proto-Tube Products Inc. – Eagleville, PA
JLO Metal Products Inc. – Chicago, IL
United Industrial Trading Corp. – Troy, MI
Electroline Products – Canton , OH
Samson Industries, Inc. – Los Angeles, CA
Evans – East Providence, RI
Kenlen Wire Co., Inc. – Livingston, NJ
P & G Machining, Inc. – Bay Shore, NY
Volkert Precision Technologies, Inc. / Arlin Tool Div. – Queens Village, NY
Fabricated Metal Products, Inc. – Naugatuck, CT
Aranda Tooling, Inc. – Huntington Beach, CA
Cambridge Automatic Inc. – Natick , MA
Clary Div. Of Alpine Engineered Products, Inc. – Grand Prairie, TX
American Micro Products, Inc. – Batavia, OH
Vicar International – Union, NJ
Hardware Specialty Co., Inc. – Long Island City, NY
J & J Swiss Precision, Inc. – Deer Park, NY
Diamond Fasteners, Inc. – Farmingdale, NY
Olin Brass/Fabricated Products – East Alton, IL
Western Metal Spinning & Mfg. Corp. – Perris, CA
Seidel, Inc. – Waterbury, CT
O.P.M. Trading Co. USA, Inc. – Massapequa Park, NY
AIMSCO, Inc. – Seattle, WA
Hardware Specialty Co., Inc. – Carlsbad, CA
Hanlon Industrial Fasteners, Inc. – Marlboraugh, MA
Fischer Special Mfg. Co – Cold Spring, KY
Empire Fasteners, Inc. – Long Island City, NY
Neider, F.A., Co. – Augusta, KY
Mathews & Co. – San Clemente, CA
American Tube Fabricating Corp. – Watertown, CT
Owen Tool & Mfg. Co., Inc. – Plainville, CT
Eddy Corporation, The – New Milford, CT
R.I. Metpro Inc. – Warwick, RI
Celus Fasteners Mfg., Inc. – Andover, MA
Precision Stamping – Farmers Branch, TX
Jagemann Stamping Co. – Manitowoc, WI
Axelrod, S., Co. – New York, NY
Nova Wesco Inc. – Waterbury, CT
Ho Hung Ming/Hiker Enterprises Ltd. – Scarborough, ON
Bedford Products Co., Div. of Legg Plastic Products, Inc. – Roanoke, VA
Marvell Pharmacal & Packaging Co. – Fairfield, NJ
Gerstle, Walter N., Inc. – Irvington, NJ
Globe Products Co., Inc. – Ennis, TX
Lord & Hodge, Inc. – Middletown, CT
Labold Corp. – Columbus, IN
Barratt Tool Co., Inc. – Wolcott, CT
Braxton Mfg. Co. of California, Inc. – Costa Mesa, CA
Tranoco, Inc. – Travelers Rest, SC
Wall, A.T., Co., Metal Components Div. (MCD) – Warwick, RI
Eyelet Crafters, Inc. – Waterbury, CT
Microwave Specialties, Inc. – Plainville, MA
VAK Industries, Inc. – Moriarty, NM
Amark Industries, Inc., Kenlen Wire Products Div., – Livingston, NJ
Amark Industries, Inc., K&K Screw Machine Products Div. – Livingston, NJ
Drawn Metal Products Co. – Niles, IL
Elect-O-Matic Co., Inc. – Watertown, CT
Johner Mfg. Corp. – West Milford, NJ
AMP, Inc. – Wolcott, CT
Process Metal Stamping Co. – City of Commerce, CA
Samson Industries, Arizona Div. – Phoenix, AZ
Walsh Eyelet Co. – Waterbury, CT
Transfer Tool Products, Inc. – Grand Haven, MI
Nytex Automatic Products, Inc. – Fredericksburg, TX
J&J Precision Eyelet Inc. Thomaston, CT
Admiral Screw Co. – Elk Grove Village, IL
Bowcraft Trimming Co., Inc. – Passaic, NJ
Geiger, H.G., Mfg., Inc. – Bronson, MI
Industrial Die & Machine Corp. – Canton, MA
International Stamping, Inc. – Warwick, RI
Metal Flow Corp. – Holland, MI
Page Madden Corp – Livingston, NJ
Rau Fastener, Inc – Providence, RI
Snapco Mfg. Co. – Irvington, NJ
Hydro Aluminum Adrian – Adrian, MI
Eyelematic Mfg. Co., Inc. – Watertown, CT
Knight Mfg. Co. – Waterbury, CT
Marvin Mfg. Inc. – Prospect, CT
Neuweiler, Karl – Berkeley Heights, NJ
Dask, J.B., Corp. – Norwood, MA
Greene, G.G., Enterprises, Inc. – Warren, PA
Neo Products Corp. – Henderson, TN
Precision Stamping Co., Inc. – Howell, MI
Spiveco, Inc. – Anaheim, CA
SureSnap Fastener & Trim Inc. – New York, NY
Truex Inc. – Pawtucket, RI
Apparel Adornables – New York, NY
Ben-Art Mfg. Co., Inc. – Prospect, CT
Davey Products – Red Lion, PA
Eyelet Enterprises, Inc. – Dorchester, MA
Fixam Inc. – Racine, WI
Teleflex Automotive Mfg. Corp. – Waterbury, CT
Setting Tools, Inc. – Naperville, IL
Bridgeport Slitting Co., Inc. – Bridgeport, CT
Acme Eyelet & Stamping Co. – St. Charles, IL
Ark Products Co. Inc. – Willow Street, PA
Atlanta Hardware Specialty Co. – Norcross, GA
Ferre Form Metal Products, Inc. – Oakville, CT
PCB Eyelets Inc. – Goleta, CA
Taylor Metal Products Co. – Mansfield, OH
Electro Optics Mfg., Inc. – Wyandotte, MI
Cerzel Tool & Engineering Co., Inc. – Broadview, IL
Richards Metal Products Inc. – Wolcott, CT
Zenex Tool Co. – North Bergen, NJ
GKY Industries – Jersey City, NJ
Sentenac Associates Inc. – Panorama City, CA
Anstro Mfg. Co. – Wolcott, CT
Burgess Mfg. Corp. – Suwanee, GA
Challenge Eyelet Press Co., Inc. – East Dorset, VT
Draw Form Inc. – Zeeland, MI
Enterprise Carbide Tool Co. – Watertown, CT
Liberty Metal Products Co. – Woodside, NY
Metalock Repair Service, Inc. – Willow Springs, IL
Scientific Decorating – Millis, MA
Yale Hook & Eye Co. – Newark, NJ
BMW Inc. – Lynn, MA
Boston Machine Works Co. – Lynn, MA
Duvall Screw Products, Inc. – Cedar Hill, MO
Henefelt Precision Products, Inc. – Largo, FL
Eyelet Design Inc. – Wolcon, CT
Swiss Automatic Products – San Jose, CA
Thuro Metal Products, Inc. – Brentwood, NY
C & R Machine Products, Inc. – Bohemia, NY
Hi-Tech – Greenville, SC
Van-Ho Mfg. Inc. – Waterbury, CT

This calculates the delfection of the outer race of a bearing when it is pressed into a housing.
These equations are from Shigley and Mischke “Mechanical Engineering Design” Fifth Ediion p.62-63
Bearing			Housing
Modulus of Elasticity of Inner component (Ei)	30000000		Modulus of Elasticity of Outer component (Eo)
Inner Radius of Inner Component (land radius)(ri)	0.1705		Outer Radius of Outer Component (ro)
Poisson’s Ratio of Inner Component (vi)	0.292		Poission’s Ratio of Outer Component (vo)
Radius at Press (interface) (R)	0.1875
Radial Press (d)	0.0003
Results
Resulting Pressure (p)	2599.551782
Increase in Housing Outer Radius (delta ro)	0.000123797
Decrease in Bearing Inner Radius of OD (delta ri)	0.000176203
Assumptions:
Both members have the same length.
Cross sections are uniform.
Radial interference is constant around the circumference.

Inputs
H1	0.4	0.4	0.4
H2	0.368	0.368	0.368
Spring Description	proposed	Shipped to Phillips	Standard
Spring Number =	10249111	10249210	10249241
FL = Free Length (in) =	0.4375	0.5625	0.4375
k = Spring Constant (lb/in) =	5.8	2.2	2.9
SH = Solid Height (in) =	0.183	0.172	0.138
d = Wire  Diameter (in) =	0.012	0.01	0.01
OD = Outside Diameter (in) =	0.088	0.088	0.088
G: Torsion modulus (psi) =	1.15E+07	1.15E+07	1.15E+07
Calculations
Ssy = est. torsional yeild strength (psi) =	161,783	166,147	166,147
DH = H1-H2 (in) =	0.032	0.032	0.032
FS2 (lb) per spring =	0.40	0.43	0.20
H2 (in) =	0.368	0.368	0.368
% compression at H2 =	27%	50%	23%
H1 (in) =	0.400	0.400	0.400
% compression at H1 =	15%	42%	13%
FS1 (lb) per spring at H1 =	0.22	0.36	0.11
F1 (lb) =
% diff (F2-F1)/F2 =
ratio: Deflection to Free Length =	0.16	0.35	0.16
ratio: Free Length to Mean Dia. =	5.76	7.21	5.61
No Buckling Zone(Yes/No)	yes	no	Yes
D = mean diameter (OD-d) (in) =	0.076	0.078	0.078
C = Spring Index D/d =	6.3	7.8	7.8
K: Wahl correction factor =	1.2	1.2	1.2
tmax = max stress in wire (psi) =	55,879	101,067	47,605
N = est. no. of active coils =	11.7	13.8	10.4
FS = safety factor = Ssy/tmax =	2.9	1.6	3.5
W = weight of the spring (lb) =	0.000122	0.000102	7.76E-05
f = fundamental frequency = (hz) =	2141.628	1440.667	1899.061
no. of times greater than freq. of motion =	308	207	273

Demonstrate to the customer the machine's ability to meet specific performance requirements of the machine's Quality Assurance Procedure.
To demonstrate to the customer a simulated production run at the Bevier Street manufacturing site.
To explain to the customer all options and to verify that all aspects of the order are correct.

Before the customer's arrival in Binghamton, each machine will undergo standard quality assurance testing as stated in the Quality Assurance Procedure (QAP) document. Each specific machine will have followed the Quality Assurance Criteria (QAC) for final inspection. (Copies of these documents are available to the customer upon request from the Customer Acceptance Group.

Upon the customer's arrival at Universal Instruments for customer acceptance, the machine is demonstrated to the customer by the customer acceptance group and a manufacturing technician. The procedure for customer acceptance follows a predetermined plan which is agreed upon prior to the customer's arrival in Binghamton. (Example: UIC material or customer material.)

The customer acceptance objective is to insert a number of components, at a specified machine insertion performance and with a specified machine intrinsic availability for each machine type. (Refer to the Products Division Customer Acceptance Plan, part number 43794400, for the correct numbers for each machine.) During the acceptance, all options on the machine are explained and demonstrated to the customer and the customer is encouraged to question the Universal representative as to detail.

Customer Acceptance should be planned to take one full working day, per machine being accepted. (This includes the CA run, training, etc.)

 

Quality Control

This section describes the machine Performance Certificate, a result of the Quality Acceptance Test (QAT), which is produced for all Axial products.
Every Axial machine is subjected to a Quality Acceptance Test (QAT) before being shipped to its customer. There are 4 phases to a QAT:

Phase I – Pre-Dry Cycle

The appropriate pattern program is loaded and the machine performs a short part run with all motions and mechanisms functioning to check setups and speed. All data is recorded on the machine's event log.

Phase II – Dry Cycle

Can only occur after successful completion of the Pre-Dry Cycle. The machine is run with all motions and mechanisms functioning but without boards or inserting components for a pre-specified period of time. All data is recorded on the machine's event log.

Phase III – Integrity Run (Final Run)

Can only occur after successful completion of the Dry Cycle. This is a simulated production run to check insertion performance and speed. Results are recorded on the machine's event log.

	Sequencer 6 2596C	VCD/Seq. 8 6241F	DH VCD 8 6292C/ 6298C	DH JW 8 6293C/    6299C	Radial 8 6380A/6388A
Phase I
Parts Run	2,400	2,100	2,400	2,400	500
Insertion PPM *	0	0	0	0	0
Intrinsic Availability **	100%	100%	100%	100%	100%
Phase II
Length of Run	2 hrs.	24 hrs.	12 hrs.	12 hrs.	12 hrs.
Intrinsic Availability	95%	95%	95%	95%	95%
Phase III
Minimum Parts Run	11,939	22,306	26,765	43,299	30,680
Allowable Insert Errors	0	1	0	0	4
Intrinsic Availability	95%	95%	95%	95%	95%
Acceptable PPM Levels	34 – 250	10 – 200	40 – 150	7 – 75	300
Confidence Level	95%	95%	95%	95%	95%

 

 

• (# of good insertions / total # of insertions)
  ** (# of hours the machine is ready to run / total # of hours machine planned to run)

Phase IV – Customer Acceptance (Optional)

Can only occur after successful completion of the Integrity Run. The customer visits the factory to watch verify the machine's ability to meet performance requirements. The customer's production run is simulated and all options are verified and explained. UIC can supply the PC boards, pattern programs and components or the customer may supply these items. (Must be supplied two weeks prior to the customer acceptance date.)

Phase V – Preproduction Acceptance (At customer site)

UIC Field Service personnel installs the machine and assures it is setup and running with the same degree of operational efficiency as at the factory.

Each machine ships to the customer accompanied by a Machine Performance Certificate, a result of the Quality Acceptance Test (QAT). This certificate sites the results of the QAT, characterizes our manufacturing process and states our commitment to quality and customer satisfaction. (See attached sample copy.)

Please take care when discussing this information with customers!! These QAT results, specifically PPM levels, are an indicator of the performance quality of the machines we ship, but actual performance in customer production environments will vary depending upon their setups and maintenance as stipulated in UIC manuals. Clearly, customers who follow our machine operation, setup and maintenance procedures should expect to average PPM levels as defined in the QAT for each machine.

 

For Through Hole Components

This document should be used as a supplement to existing machine General Specifications and IM Design Guidelines.  This document is designed as a checklist rather than a reference for use when examining an existing or new product.  For detailed specifications refer to the appropriate General Specification.

 

PC board considerations

For Axial or Radial auto insertion:

 

• Is the overall size of the board within specification?  (max/min size varies by machine and board handling type)
• Is the board thickness within specification?

Possible challenges:

Radial can accept boards from 0.032” to 0.093” thick with no set up change, axial machines require mechanical adjustment to handle thickness variations.

• If using automatic board handling, is the board shape acceptable?  (i.e. contiguous edges.)

Possible challenges:

Non-contiguous edges, may work but requires testing.  Example, instrument cluster.

• Is the board a good candidate for panelization?  (i.e. creating multiple images of the same board on one panel for ease of assembly and increased throughput.)
• Is the board warpage within specification?

Possible challenges:

Warpage can cause issues with insertion as well as clinch angle/length, especially on radial machine.

• Does the PC board contain location reference holes to allow proper fixturing?

Possible challenges:

If product was previously hand assembled it may not have locating holes.

• Are the components positioned at 0º and/or 90º with respect to the X axis?

Possible challenges:

Sometimes components are arranged at odd angles because of space constraints or because designer wanted to keep component body straight.  (example: ECCO board.)

• Are the component hole diameters within specification for each component type (lead diameter) being inserted?

Possible challenges:

Boards currently hand assembled are most likely to have undersize holes.

• Is there sufficient clearance below the board for the clinched component leads?  Consider the following:
  • Solder bridging to other component leads
  • Solder bridging to via holes or adjacent pads

Note: Universal does not specify required clearance to prevent solder bridging, this should be determined by the customer.  However, obvious cases of conflict should be noted.

• Is there sufficient clearance for the insertion and clinch tooling?  Take into consideration:
  • Previously inserted IM components
  • Previously placed SM components
  • Workboard holder locating and support fixtures
  • Obstructions on the bottom of the board that could interfere with the clinch or board transfer.

 

Component and tooling considerations

 

Axial

• Are components packaged properly for automatic insertion?  (Tape and reel/ammo pack)

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

• Is the component input tape width (i.e. 26mm or “standard”) compatible with the component hole span?

Possible challenges:

Universal does not offer a machine that can accept 26mm input.  Virtually all components are available in 52mm format, however, a subcontractor may have to deal with “kits” from an OEM that contain 26mm components.

• Is the insertion tooling (i.e. 5mm, 5.5mm or standard) compatible with the component hole span?

Possible challenges:

Does the product include both very wide and very narrow span components?  Use tooling selection matrix to evaluate best tooling fit.

• Is the component hole span compatible with the component body length?

Possible challenges:

Be especially careful when moving product from hand assembly to automatic assembly.

• Is the component body diameter compatible with the board thickness and insertion tooling requirements?

Possible challenges:

Watch out for very thick boards and/or large diameter components.

• Is the component lead diameter compatible with the insertion tooling?  (i.e. standard vs. large lead)

Possible challenges:

May have to sacrifice (to hand assembly) some insertions at either the large end or the small end of the spectrum.

• Does the component require a stand off between the body and the PC board?  Components requiring a stand off cannot be inserted with an axial inserter, but may be auto insertable with a radial inserter if packaged in the proper format.

Possible challenges:

“Stand-off” type resistors are more common where high power handling is required, power supplies, monitors, etc.

 

Radial

• Are components packaged properly for automatic insertion?  (Tape and reel/ammo pack)

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

• If components are packaged on tape, use the following “quick check” list to get a general idea of which components may be automatically inserted:  (See note 1 below)
  • Body diameter 13.0mm or less
  • “H” dimension (distance from centerline of feed hole to bottom of component) within acceptable limits
  • Lead diameter within acceptable limits

Possible challenges:

Radial taping specifications are quite involved, use “quick check” list as a sanity check, forward component samples to applications group for detailed evaluation.

• Are the lead spans of the components compatible with standard automatic radial insertion?  (i.e. 2.5mm, 5.0mm, 7.5mm or 10.0mm)  (See note 2 below)

Possible challenges:

1)    May have to “sacrifice” some components to hand assembly because of tooling footprint issues or span requirements.

2)    Some PCB’s contain components are non-standard span’s, i.e. 2.0mm, 4.0mm.

• Are transistor leads in line? (i.e. not in a “triangle” configuration)
• If the component is required to stand off the PC board, are features built into the component lead to accomplish this?

Possible challenges:

Board designer may “require” a certain type of standoff without checking to see if the package is readily available, common with LED applications.

 

Notes:

1)  The simplified guidelines were created to draw attention to the most common areas where components fall outside the limits for auto insertion.  These simplified guidelines should only be used as a general guide.  Component input must meet all criteria called out in the Radial General Specification.

2)         Tooling selection will depend upon insertion span requirements as well as board density considerations.     Muniak98-052B  Revised 01-00

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