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Replace the PEC Camera Assembly

If the PEC Camera Assembly is damaged or experiences an electrical or optical failure, the camera must be replaced.

Prerequisites

Make sure that the following items are available before beginning the procedure:

• A new PEC Camera Assembly
  
• A calibration kit and a new PEC gray card
  

Remove the PEC Camera Assembly

To remove the faulty PEC Camera Assembly from the head cage, perform the following procedure:

1. Power down the machine and perform Lockout/Tagout according to local procedures.
   

1. Open the access cover.
   
2. Move the beam to a location where the PEC camera can be easily accessed.
   
3. Disconnect the PEC_VIDEO/PWRPL and PEC_LED_CTRPL cables from the Head Cage Interface PCA.
   
4. Remove all cable ties securing the PEC camera cables to the head cage.
   
5. Remove the PEC camera cables from the cable clamps on the bottom of the head cage.
   
6. Remove the screws that secure the PEC lighting to the PEC camera. Let the lighting hang loose from the hole in the carriage plate.

7. Disconnect the PEC lighting cable from the PEC lighting. Set aside the PEC lighting.
   
8. Remove the screws that secure the PEC camera to the carriage plate.
   
9. Lift the PEC camera out of the head cage and discard.
   

Remove/Install the PEC Camera Assembly

If the PEC Camera Assembly is damaged or experiences an electrical or optical failure, the camera must be replaced.

Prerequisites

Make sure that the following items are available before beginning the procedure:

• A new PEC Camera Assembly
  
• A calibration kit and a clean, undamaged PEC gray card
  

Remove the PEC Camera Assembly

To remove the faulty PEC Camera Assembly from the head cage, perform the following procedure:

1. Power down the machine and perform Lockout/Tagout according to local procedures.
   

1. Open the access cover.
   
2. Move the beam to a location where the PEC camera can be easily accessed.
   
3. Disconnect the camera control/interface cables from the Head Cage Interface PCA.
   
4. Remove all cable ties securing the PEC camera cables to the head cage.
   
5. Remove the PEC camera cables from the cable clamps on the bottom of the head cage.
   
6. Remove the screws that secure the PEC lighting to the PEC camera. Let the lighting hang loose from the hole in the carriage plate.
   

   (Typical PEC Camera and old-style mount shown below)
   

   
   

   (New-style PEC mount shown below)
   

   
   

7. Disconnect the PEC lighting cable from the PEC lighting. Set aside the PEC lighting.
   
8. Remove the screws that secure the PEC camera to the carriage plate or mounting block.
   
9. Carefully remove the PEC from the head cage.
   
10. If installing a camera with a different magnification, remove the 6 frame fiducial inserts on the feeder uprights and the 4 nozzle changer fiducials on the nozzle changer. Retain for use with the .4 MPP PEC camera.

    For UPS+ 7.5SC and higher with a .4 MPP PEC camera: Remove the 6 frame fiducial inserts on the feeder uprights; they will not be re-installed.
    

Install the PEC Camera Assembly

To install the PEC Camera Assembly, perform the following procedure:

1. Carefully move the PEC camera into the head cage and position on the alignment pins.
   
2. Apply Loctite 222 to the PEC camera mounting screws.
   
3. Install the PEC camera mounting screws and torque to 1,36 Nm (12.0 in-lb.).
   
4. Connect the PEC lighting cable to the PEC lighting.
   
5. Install the PEC lighting to the new PEC camera and secure with the screws removed earlier.
   
6. Route the PEC cables through the cable clamps on the bottom of the head cage.
   
7. Connect the camera control/interface cables to the Head Cage Interface PCA.
   
8. Install new cable ties to secure the PEC cables to the head cage. Do not over-tighten the cable ties.
   
9. If installing a .4 MPP PEC camera where one did not exist previously, install the 6 frame fiducial inserts on the feeder uprights and the 4 nozzle changer fiducials on the nozzle changer. Install over the existing fiducials.

   For UPS+ 7.5SC and higher with a .4 MPP PEC camera:  Do not install the 6 frame fiducial inserts on the feeder uprights.
   

10. Close the access cover.
    
11. Power up the machine.
    
12. Determine if the machine is equipped with the Cognex Vision system:
    
    1. Open Diagnostics II.
       
    2. Select Version Information > Hardware Options > Vision Systems.
       

1. Calibrate the PEC camera and lighting. For instructions, see the PEC Calibration: Camera and Lighting (Multifunction Machines) help topic in Voyager.
   

PEC Camera Polarizing Components

The PEC camera consists of two elements: a rotating polarizer that covers four of the eight illumination petals and a sliding polarizer. The sliding polarizer is located in the camera aperture. The axis of this polarizer, frequently referred to as the “analyzer”, is orthogonal to that of the rotating polarizer. The combination of these polarizers on the module results in cross-polarized illumination.

(Typical PEC Camera shown)

The rotating polarizer ensures that the substrate is illuminated with linear polarized light. The metal features and ceramic background reflect polarized light differently. The light reflected from the metal has no net change in polarization. Because the orientation of the sliding polarizer located in the camera aperture is orthogonal to that of the rotating polarizer, most of the light reflected from metal features is blocked. Therefore, metal features appear dark on the camera.

In contrast, the ceramic surrounding the metal features randomizes the polarization upon reflection. Because the polarization is randomized, a portion of the reflected light can pass through the central polarizer and reach the camera. Therefore, the ceramic background appears as a shade of gray.

The following table summarizes the polarization effects on metals and ceramics:

Polarized Lighting Zones

The PEC Lighting Assembly has two lighting zones. Which zones are used for imaging depends on the type of substrate being imaged. The two lighting zones are shown in the table below.

Petal Zones I and II each contain four illumination petals positioned at 90 degrees to each other. The illustration below shows how the Red (R) and Blue (B) LEDs are oriented.

Selectable Polarizer Positions

The PEC Lighting Assembly is equipped with a rotating polarizing filter and high intensity LEDs. The PEC camera has a polarizing film mounted within a rotating ring and a second polarizer mounted on a slide above the lighting module. Certain classes of flexible circuits image well with cross-polarized illumination. For the polarized option, it is recommended that the central polarizer be left in place.

• The blue lighting zone of the PEC Lighting Assembly is designed to image flexible circuits.
  
• The red lighting zone of the PEC Lighting Assembly is designed to image ceramic circuits.
  

The following table summarizes the available Polarized lighting options:

SMT Soldering machines are a crucial part of the manufacturing process as they help to ensure consistent soldering quality in a product. These machines cover an array of equipment, including SMT Reflow Oven, SMT /BGA soldering stations (used for single component placement/Removal) also known as SMT /BGA Rework Stations.

By using SMT soldering machines, manufacturers can improve the thermal conductivity and lower the assembly costs because less labor and solder paste are required. Today, these machines are very technologically advanced and use the latest soldering technology, which can reliably solder surface mount components.

Lead-Free Reflow Oven S-6600

FEATURES
○ Complete for the lead free process
○ Adopt instrument control System and closed loop control for heating source of each zone.
○ Temperature control adopt circulation hot air heating mode for each zone;
○ Closed loop control for conveyor system, can go along steadily stepless rate-adjusting;
○ With over heating alarm function;

 

BGA Rework Stations B006

SPEC.

●power：AC220V±10％ 50/60Hz
●Total Power：Max 4800 W
●Heater power：top heater 800 W bottom heater 1200 W IR heater 2700 W
●Electrical materials: PLC Programmable controller＋Touch screen＋High precision intelligence
temperature control module
● Temperature control: K-type thermocouple (Closed Loop)
● Positioning: V-groove, PCB support
● PCB size: Max 410×370 mm Min 20×20 mm
● BGA chip: L630×W610×H6a90 mm
● Weight: 43 kg

 

Solder Preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010″ (.254mm) up to 2″ (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.

 

• Increased solder volume
• Improved drop test results
• Fewer issues with flux residue
• Reduced rework
• Improved fillet shape and volume

 

 

 

 

 

 

S-1688 Pneumatic stencil cleaner

• Complete pneumatic operation without any fire risk
• Equipment is ergonomically in designed
• Cleaning and drying process is a simple one-button operation
• Patented nozzle precision design ensure high cleaning process
• Interior special design for better effect on rinsing and drying
• Stencil tension is not affected during the cleaning process
• Auto liquid feeding and draining system
  our levels filtering system with precise exhaust design and control
• Liquid can be recycled which results in lower solvent consumption
• Internationally recognized critical components are used to ensure
  long-term quality and reliability
• Modular design to ensure easy maintenance
• Solder paste and glue will adhere to the stencil hole during printing process
• Manual cleaning is not effective in removing the solder paste deposit. Solidified and hardened deposits can cause the stencil mesh to deform
• The printing quality will be adversely affected if the stencil is used
  without proper cleaning

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Pneumatic stencil cleaner Pneumatic stencil cleaner Pneumatic stencil cleaner Pneumatic stencil cleaner

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S1688 Pneumatic Stencil Cleaner Machine (more…)

MISPRINT CLEANING

INTRODUCTION

Assemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry has used stencil cleaning agents and equipment to address this rework need. One of the benefits of cleaning misprinted assemblies with the stencil cleaning process is the ability to collect and filter wet solder paste. The major short coming of cleaning misprints within stencil cleaning processes is the inability to remove B-side reflow flux residues from both the surface and under bottom termination components.

 

REWORKING/CLEANING MISPRINTED ASSEMBLIES

Stencil printing is a highly automated process. During machine setup, a small group of boards are misprinted. During production stencil printing, circuit boards are periodically misprinted due to clogged apertures, stencil out of alignment, solder paste rheology shifts and other issues. Stencil misprints are defined as A-Side (Initial print out of alignment with no components previously placed) and B-Side (A-Side was successfully printed and components placed and soldered. The subsequent process of printing the B-Side results in the solder paste being out of alignment resulting in a B-Side misprint).

 

Printed Circuit Board misprints are a costly problem with no easy rework methodology. Production cleaning processes are normally not used to clean misprint assemblies. Potential quality issues such as:

• Solder balls collecting into the wash tank and being transferred back onto the assembly
  
• Solder balls migrating into the rinse streams resulting in hazardous waste from metals in the wash and rinse holding tanks
  

These complexities potentially compromise repeatability and reliability standards. Due to these complex issues, most assembly houses do not allow misprints to be cleaned within their production cleaning process.

 

Assemblers commonly address the misprint cleaning need by either hand wiping the misprinted side of the circuit card and/or clean the misprint in a stencil cleaning machine. Both methods create the potential for quality issues. First, when wiping solder paste from the misprinted side of the board, solder paste can be trapped in solder mask defined channels, through-hole vias, and other board geometries (Figure 1). Numerous quality problems can result due to lack of control and definition.

 

Figure 1: Solder Balls Wedged into No Solder Mask Defined Channels and Via Holes

 

Second, stencil cleaning machines are designed to remove wet solder paste from stencils. Most stencil cleaning processes do not rinse the stencil with water. For those that use a water rinse, the water is reused since trace levels of metals in water prevent disposal to local treatment works. Cleaning a production board in a machine designed to clean stencils fails to meet ionic cleanliness standards required for a production assembly. Additionally, on B-Side misprints, the stencil cleaning agent is typically not adequate for cleaning reflowed flux residues on the A-Side of the board. In most cases, the stencil cleaning agent partially removes the reflowed no-clean flux residue resulting in white residue and an ionically dirty assembly.

 

FILTRATION OPTIONS

Cleaning the misprinted circuit board within an electronic assembly production cleaning process has the potential to achieve cleaning of wet solder paste and reflowed flux residues as well as meet quality and yield objectives. The problem with cleaning a misprinted circuit board in a production cleaning process is the deposits of solder spheres collected into the wash holding tank. Free solder spheres within the wash holding tank can be picked up by the inlet of the pump and sprayed onto production assemblies. There is also the potential that the solder spheres can be dragged into the rinse sections. Both quality and waste treatment issues result from this practice.

To resolve the quality and water treatment issues, collection and filtration method systems are needed to trap and filter solder spheres. Filtration systems designed tocontain the solder spheres and capture them prevents spraying solder balls through the pump and spray manifolds. The mechanical and filtration systems resolve the issues of redepositing solder balls onto production assemblies and the potential to contaminate rinse streams. The overriding quality advantages in using production cleaning equipment, which is designed for repeatedly removing all solder spheres from the assembly, remove reflowed flux residues and render an ionically clean printed circuit board provide a reproducible and repeatable product.

EQUIPMENT OPTIONS

Inline Cleaning Equipment

Two types of aqueous production machines are used to clean electronic assemblies, inline and batch. For the inline machine, the pre-wash section of the cleaning machine is designed to wet, elevate the circuit board to wash temperature, and soften reflowed flux residues from production circuit assemblies. On option for containing solder balls is to equip the pre-wash sectionwith deflectors that contain the raw solder paste as it is being displaced from the circuit assembly. The deflectors close in the pre-wash spray manifolds using two trays and plates to prevent solder spheres from escaping the housing of the pre-wash section. As the boards enter the pre-wash section, the displaced solder balls and wash fluid drain into the catch trays. By capturing and containing the pre-wash liquid, the majority of the solder balls can be channeled into a series of sluice boxes. This important design feature contains the bulk of the solder balls with a minimal amount escaping to the wash holding tank.

 

 

A series of Sluice Boxes can be designed to capture the heavy raw solder spheres similar to the techniques used in mining precious metals from water streams (Figure 5). Three separate sluice boxes capture the majority of the solder paste. Each sluice box is equipped with a wire mesh. The weight of the solder balls drop through the wire mesh and collect into the sluice box trays. The first sluice box captures the majority of the solder spheres with the remaining two sluice boxes used to collect the residual solder spheres.

Figure 3: Sluice Box Collection Boxes courtesy of Speedline Technologies

Solder balls that are not collected within the sluice boxes will drain into the wash fluid holding tank. To prevent these stray solder balls from being sprayed onto circuit boards, three pump intake strainers prevent large spheres from entering the pump (Figure 6). The smaller solder spheres that pass through the strainers will be captured in a bag filter from wash liquid pumped through the outlet of the pump.

Figure 4: Strainers in Suction Inlet of the Wash Holding Tank courtesy of Speedline Technologies

Following the suction strainers, the wash solution is pumped through a filtration system designed to collect any remaining solder spheres before reaching the spray manifolds. The wash outlet enters the top side of the filtration canister, exits the clean side of the filter and then goes to the spray jets.

Figure 7: Filtration Canister

Within the canister, there are internal bars that prevent the bag filter from getting next to the exit side of the filter housing. This design feature prevents back flow or resistance as the liquid pumps through the filter canister. The 10/5 bag filter cartridge (ten microns on the inside and 5 microns on the outside of the filter cartridge) provides double redundancy to contain any solder balls from escaping the filter (Figure 9). The 10 micron side captures the heavy particles and the fine 5 micron side of the filter assures no solder spheres are sprayed onto circuit cards. The filtration design removes solder balls as small as Type 5 Solder Paste while preventing solder balls going to the manifolds. Pressure drops are minimal due to the solder paste being captured within the bag filter. Should the pressure drop, the machine is equipped with a user defined interface, which sends an alarm to the operator. The design is such that thousands of misprint boards could be cleaned before having an impact on the bath integrity, pressure and cleaning performance.

Batch Cleaning Equipment

One main difference between batch cleaning machines versus an in-line type cleaner is the ability to program the type of wash cycle, the sequence, and cycle times within the cleaning process. It is therefore critical that the ability to effectively trap and collect wet solder paste be integrated into the batch cleaner wash cycles.

 

The design objective is to provide the board assembler the flexibility to deflux their normal production runs (A/ B side), deflux an A-side with B-side misprint, clean A/B side misprint, plus the ability to completely rinse and dry the product within the same batch type cleaner.

Similar to the design for the in-line cleaning system, the same equipment manufacturer used the multi-stage filtration approach to effectively collect solder spheres and to prevent the spheres from being sprayed onto the board assembly. A pre-wash type cycle in the batch cleaning process will wet, elevate the circuit board to wash temperature, and soften the reflowed flux residues from the production circuit assemblies. The flux composition with the raw solder paste is easier to remove than the reflowed paste. An internal bag type filter is used to capture the raw solder paste that is removed during the Flood Wash cycle . The main purpose of the internal bag filter is to minimize the amount of solder paste that would be drained into the wash fluid holding tank.

Figure 8: Bag Filter in Wash Holding Tank

Solder spheres that are not collected in the bag filter will collect in the wash fluid holding tank. To prevent large particles from entering into the wash pumps, two intake strainers are located in the wash holding tank.

Figure 9: Batch Intake Strainers

Following the suction strainers, the wash solution is pumped through a filtration system that is designed to capture the smallest of solder spheres before being sprayed through the wash fluid spray delivery system. The filtration system is designed to capture solder paste as low as type 5 paste (Figure 10).

Figure 10: Batch Filtration Design

SUMMARY

Cleaning both A-Side and B-Side misprints has been a complex problem for assemblers. Using a stencil cleaner to clean misprints has numerous flaws. Two key issues is the inability to remove reflowed flux residues with stencil cleaning agents and poor rinsing. Notwithstanding, most assembly houses do not allow misprints to be cleaned in production cleaning machines due to the risk of contaminating product boards with stray solder balls and due to waste water metal contamination issues.

 

Collection and filtration systems designed into inline and batch production cleaning equipment safely captures and contains solder spheres from being sprayed onto production assemblies. Additionally, the containment and filtration systems prevent raw solder paste from entering the rinse water streams.

 

Using a production cleaning machine provides numerous benefits to the assembler.

1. Recovery and rework of expensive hardware
   
2. Removal of wet solder paste
   
3. Containment of solder spheres
   
4. Removal of reflowed flux residues
   
5. Exceptional rinsing
   
6. Ionically clean assemblies
   
7. Repeatable
   
8. Reproducible
   

 

Wiping wet solder paste from production assemblies is a bad practice. When wiping wet solder paste, solder spheres can be wedged into no solder mask defined troughs, vias and other offsets. When these solder balls become wedged, high levels of energized sprays may not be sufficient in displacing a wedged solder ball.

Cleaning Evaluation

 

 

Advantages of (2)
Powerful Cleaning Capability

Two ultrasonic cleansing head panels clear each the back and front sides of the metallic stencil concurrently. Ultrasonic power is utilized on to the stencil offering superior cleansing functionality.

Ease of Operation
Just press the beginning button and the method of cleansing and drying might be accomplished. No operator dealing with is required.

Low-VOC Cleaning Agent
Low-VOC cleansing agent, VIGON SC200 can be utilized for SC-AH100F-LV. There is not any flash level, low evaporation and virtually no odor. A good working setting might be maintained.

Reduction of CO2 Emission
reduces power consumption because of the shortened tact time and accordingly reduces CO2 emissions.

Cleaning Evaluation

 

 

 

 

 

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